IntelŪ PentiumŪ III Processor
    The products you are looking for are no longer manufactured by Intel. Additionally, Intel no longer provides interactive support for these products via telephone or e-mail, nor will Intel provide any future content updates or software updates to support new operating systems or improve compatibility with third party devices and software products. THESE PRODUCT SUPPORT DOCUMENTS ARE PROVIDED FOR HISTORICAL REFERENCE ONLY AND ARE SUBJECT TO THE TERMS SET FORTH IN THE "TERMS OF USE" INFORMATION. Information on currently available Intel products is available at www.intel.com and/or developer.intel.com Software and Drivers Download (Bootable Version) - IntelŪ Processor Frequency ID Utility Version 7.2 The bootable version of the IntelŪ Processor Frequency ID Utility is available in .exe format. This download does not work in DOS-emulation windows, as found in operating systems such as Linux*. Since this version is bootable, it does not depend on any specific operating system (OS independent). See the Installation Guide for detailed instructions on how to use this utility. Which Utility Should I Use? For IntelŪ PentiumŪ III processors, and processors manufactured before the IntelŪ PentiumŪ III processor, use the IntelŪ Processor Frequency ID Utility. Download (Windows* Version) - IntelŪ Processor Frequency Utility Version 7.2 The utility is available for download in a self-installing .msi file format. Supported Processors Supported Operating Systems Windows XP*, and Windows* 2000 You must have system administrative rights for successful installation on Windows XP* and Windows 2000*.
    Note | There are two processor identification utilities used to identify IntelŪ processors. The IntelŪ Processor Identification Utility is the newest identification utility. Before downloading either utility, review the supported processors list to see the processors supported by each utility.
    Frequency Test Tab The Frequency Test Tab can provide information regarding the operating status of the tested processor or system bus. It will report: Proper IntelŪ processor brand identification Processor and system bus expected frequencies Processor and system bus reported frequencies Accompanying this information is a message informing the user whether the processor is operating at its expected frequency Which processor was tested in a multiprocessor system, and total number of processors (Windows* XP, and Windows* 2000 only) Please note that this tab is only available on supported processors. IntelŪ Processor Frequency ID Utility for Windows* The CPUID Utility for Windows* is incorporated into the IntelŪ Processor Frequency ID Utility. Use the CPUID Data Screen of the utility to identify PentiumŪ processors and higher. Supported operating systems for the IntelŪ Processor Frequency ID Utility Operating System Windows 98* SE Windows 2000* Professional, Server, Advanced Server Windows Me* Windows XP* The bootable version is operating system independent. After you create the bootable floppy, you can take it to any platform, reboot, and check on the status of your IntelŪ processor.
    Note | Windows 95*, Windows 98, Windows NT* 3.51, and Windows NT 4.0 are no longer supported. Use bootable version of the Intel Processor Frequency ID Utility for systems which have Windows 95 or Windows NT 3.51 installed.
    IntelŪ Processor Identification Utility download for Windows* This utility is designed to identify current IntelŪ Processors and technologies, and enables you to run and save a processor ID report. The utility also features a frequency test to make sure that the processor is working at the tested and rated speed. The IntelŪ Processor Identification Utility video walks you through download to installation, and provides an overview of the most common technologies supported by the processor. The latest version of IntelŪ Processor Identification Utility is available for download in a self-installing .msi file format.
    Note | Microsoft Windows XP* and Microsoft Windows 2000* users must have system administrator rights to install the utility.
    Installation and Use Motherboard BIOS Does Not Configure Processor Correctly Most current motherboards will automatically configure the operating frequency and voltage of the installed processor, if the motherboard is validated for use with that processor. 1. Confirm with the manufacturer of the motherboard that the board is tested and supported for the processor. That includes the operating frequency of the processor, the voltage, and the core stepping of the processor. All three must be explicitly supported in the BIOS setup program. 2. Download and run the IntelŪ Processor Identification Utility or IntelŪ Processor Frequency ID Utility utility to confirm the operating frequency supported by the processor: 3. Refer to the documentation for your motherboard for details on processor configuration. Most boards will not require jumper configurations for the processor, but you may have to enter a configuration mode to select the correct options for your processor. 4. If necessary, download and install the most current BIOS for your motherboard. The instructions and files should be provided by the manufacturer of your motherboard. System boots with no problem but crashes/freezes or the system is unstable Important note: Only a computer professional should perform assembling, disassembling, upgrading and troubleshooting computers since the electronic devices may cause serious damage to the installer, the system, or its components if it is done improperly. Before attempting to disassemble or assemble computers, install components in a computer or troubleshoot computers, carefully review the documentation specific for the computer and its related components. Lastly, make sure to follow Electrostatic Discharge (ESD) procedures. Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem. Check to see if your system feels warm and check the processor for overheating. NOTE: Use extreme caution when checking for heat, since you can be easily burned. Make sure that the power supply fan is running properly and any other external case fans are running properly. Make sure that the air intakes for the external fans are unobstructed and have at least several inches away from walls and other items. Make sure the fans on the processor are connected properly and running. Make sure that the thermal interface material or the thermal grease is applied properly. Disable thermal measurements and power saving features in the BIOS setup program. Update the system BIOS to the newest version. In addition, check to see if your system has a firmware that could also be updated to the newest version. Refer to your motherboard documentation. Check the BIOS using the BIOS/CMOS setup utility, particularly the boot order. Make sure that your system is detecting all of the drives and make sure that the drive you are trying to boot is listed. Do not overclock your system. Your system can become unreliable, may shorten the life of your PC components, may damage your PC components and may void your warranty. Check the BIOS using the BIOS/CMOS setup utility, especially the RAM settings. Suggest running ScanDisk to see if your hard drive has a lot of lost clusters and other anomalies. If you don't properly shutdown your computer using the Start button shutdown option, you may see some lost clusters and possible bad clusters. Suggest running an updated virus checker to see if your system is affected by a virus. Suggest reloading the OS, drivers or program. Suggest reformatting the hard drive and reinstalling everything. Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use. Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer. Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document. Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight. Make sure the power cables inside the computer are attached correctly and secure. Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply). Use a voltmeter to verify the Power Good signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply. Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor. Remove the processor and RAM and reinstall them to make sure that they are installed correctly. Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much. If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system. If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system. If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system. For more information about troubleshooting IA platform systems, refer to the Troubleshooting for the IA Platform PDF document. Processor is running hot Important note: Only a computer professional should perform assembling, disassembling, upgrading and troubleshooting computers since the electronic devices may cause serious damage to the installer, the system, or its components if it is done improperly. Before attempting to disassemble or assemble computers, install components in a computer or troubleshoot computers, carefully review the documentation specific for the computer and its related components. Lastly, make sure to follow Electrostatic Discharge (ESD) procedures. Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem. Do not overclock your system. Your system can become unreliable, may shorten the life of your PC components, may damage your PC components and may void your warranty. Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use. If applicable, verify the voltage settings for the processor. Verify that your thermal solution for the processor is adequate for the processor and frequency of the processor. Check to see if your system feels warm and check the processor for overheating. NOTE: Use extreme caution when checking for heat, since you can be easily burned. Many people may be running a software package or using their BIOS setup program, which is telling them the processor is running warmer than normal. Many times, these programs and/or BIOS setup programs may be wrong. Therefore, if you not feel a large amount of heat coming from the processor and heat sink, then the processor is probably not overheating. Make sure that the power supply fan is running properly and any other external case fans are running properly. Make sure that the air intakes for the external fans are unobstructed and have at least several inches away from walls and other items. Make sure that you have power cable for the fan connected to the correct fan header specifically for the processor. Refer to your motherboard documentation for more information. Make sure the fans on the processor are connected properly and running. Make sure that the thermal interface material or the thermal grease is applied properly. Disable thermal measurements and power saving features in the BIOS setup program. Update the system BIOS to the newest version. This will often correct problems with how the system measures the processor temperature. For more information about troubleshooting IA platform systems, refer to the Troubleshooting for the IA Platform PDF document. Computer does not boot - no lights or fans - nothing on the monitor Important note: Only a computer professional should perform assembling, disassembling, upgrading and troubleshooting computers since the electronic devices may cause serious damage to the installer, the system, or its components if it is done improperly. Before attempting to disassemble or assemble computers, install components in a computer or troubleshoot computers, carefully review the documentation specific for the computer and its related components. Lastly, make sure to follow Electrostatic Discharge (ESD) procedures. Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem. Make sure the computer is plugged in and on. Make sure that the monitor is plugged in and on. Use a voltmeter or an AC wall outlet tester found in a hardware store to confirm that there is adequate AC voltage at the wall outlet. If your AC outlet is connected to an on/off outlet switch, make sure that it is on. Determine power supply voltage selector setting (230 volts vs. 115 volts) is correct. Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document. Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use. Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer. Make sure the power cables inside the computer are attached correctly and secure. Make sure the drive ribbon cables inside the computer are attached correctly and secure. Be sure to check the orientation of pin 1 of Hard Drive. If the ribbon cable is connected backwards may cause the computer not to power up. Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight. Check the cables that connect from the case to the motherboard. Be sure to include the power switch (PWR SW) and power LED (PWR LED). Refer to the motherboard manual for more information. Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply). Use a voltmeter to verify the PowerGood signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply. Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor. Remove the processor and RAM and reinstall them to make sure that they are installed correctly. Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much. Determine if motherboard/system has any security features, which would disable boot. If you are using RDRAM, make sure that all memory sockets of a channel are filled with either a memory chip or a continuity module. In addition, if the motherboard has multiple channels, make sure that you fill the first channel once and that you check to see which memory sockets go with each channel. Lastly, the RDRAM often has to be installed in pairs of the same type of memory chips. For example, you would have to install two sticks of 64 MB of RDRAM running at 800 MHz. If you are using SDRAM or DDR-SDRAM, some motherboards require you to populate the memory sockets starting with the first socket. Refer to your motherboard documentation for more information. If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system. If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system. If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system. For more information about troubleshooting IA platform systems, refer to the Troubleshooting for the IA Platform PDF document. Installation Flyer (FC-PGA Package at 1 GHz) [FCPGAFLY1G1.PDF, FCPGAFLY11G1.PDF] The installation manuals and flyers for boxed processors are now available in 11 languages: English, Traditional Chinese, Simplified Chinese, Korean, French, Italian, German, Spanish, Portuguese, Russian, and Japanese. English: Installation Manuals: English [PDF] File Name: FCPGAFLY1G1.PDF Size: 63488 Date: 09/05/00 03:05:56 PM All Languages: Installation Manuals: All Languages [PDF] File Name: FCPGAFLY11G1.PDF Size: 3003392 Date: 09/05/00 03:05:56 PM Installation Flyer (FC-PGA Package at 933 MHz) [PDF] The installation manuals and flyers for boxed processors are now available in 11 languages: English, Traditional Chinese, Simplified Chinese, Korean, French, Italian, German, Spanish, Portuguese, Russian, and Japanese. English:
    | Installation Flyer (FC-PGA Package at 933 MHz) [PDF]
    | File Name: fcpgafly1.pdf Size: 104,448 bytes Date: November 5, 1999
    All Languages:
    | Installation Flyer (FC-PGA Package at 933 MHz) [PDF]
    | File Name: fcpgafly11.pdf Size: 1,873,920 bytes Date: November 5, 1999
    Installation Manual (FC-PGA Package at 933 MHz) [PDF] The installation manuals and flyers for boxed processors are now available in 11 languages: English, Traditional Chinese, Simplified Chinese, Korean, French, Italian, German, Spanish, Portuguese, Russian, and Japanese. English:
    | Installation Manual (FC-PGA Package at 933 MHz) [PDF]
    | File Name: fcpgaman1.pdf Size: 158,720 bytes Date: March 29, 2000
    All Languages:
    | Installation Manual (FC-PGA Package at 933 MHz) [PDF]
    | File Name: fcpgaman11.pdf Size: 911,360 bytes Date: March 29, 2000
    Installation Manual (FC-PGA Package at 1 GHz) [PDF] The installation manuals and flyers for boxed processors are now available in 11 languages: English, Traditional Chinese, Simplified Chinese, Korean, French, Italian, German, Spanish, Portuguese, Russian, and Japanese. English:
    | Installation Manual (FC-PGA Package at 1 GHz) [PDF]
    | File Name: fcpgaman1g1.pdf Size: 118,784 bytes Date: September 05, 2000
    All Languages:
    | Installation Manual (FC-PGA Package at 1 GHz) [PDF]
    | File Name: fcpgaman11g1.pdf Size: 1,270,784 bytes Date: September 05, 2000
    Thermal management for IntelŪ PentiumŪ III, PentiumŪ II, and CeleronŪ Processors Introduction This document is written for professional system integrators building PCs from industry accepted motherboards, chassis, and peripherals. It provides information and recommendations for thermal management in desktop systems using boxed IntelŪ PentiumŪ III Processors, PentiumŪ II processors, and CeleronŪ processors. (The term "boxed processors" refers to processors packaged for use by system integrators.) It is assumed that the reader has a general knowledge of and experience with desktop PC operation, integration, and thermal management. Integrators who follow the recommendations presented here can provide their customers with more reliable PCs and will see fewer customers returning with problems. Thermal Management Systems using boxed processors all require thermal management. The term "thermal management" refers to two major elements: a heatsink properly mounted to the processor and effective airflow through the system chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature. Proper thermal management is achieved when heat is transferred from the processor to the system air, which is then vented out of the system. Desktop boxed processors are shipped with a high-quality fan heatsink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure adequate system airflow. This document makes recommendations for achieving good system airflow and provides suggestions for improving the effectiveness of a system's thermal management solution. Fan Heatsink Boxed processors are shipped in several processor packages: the Single Edge Contact Cartridge (S.E.C.C.) the Single Edge Contact Cartridge 2 (S.E.C.C.2) the Single Edge Processor Package (S.E.P.P.) and the Plastic Pin Grid Array (PPGA) All boxed processors for desktop systems are shipped with a fan heatsink and fan power cable. These items should be used following the directions contained within the boxed processor installation notes included in the processor box. Thermal interface material (already applied) provides effective heat transfer from the processor to the fan heatsink. S.E.C.C., S.E.C.C.2, and S.E.P.P. boxed processors ship with an attached fan heatsink with the thermal interface material included between the processor and the fan heatsink. Current PPGA boxed processors ship with an unattached fan heatsink that includes thermal interface material on the fan heatsink base and a fan cable incorporated into the fan. The fan cable provides power to the fan by connecting to a motherboard-mounted power header. Some boxed processor fan heatsinks provide fan speed information to the motherboard. (Only motherboards with hardware monitoring circuitry can use the fan speed signal.) Boxed processors use high-quality ball-bearing fans that provide a good local air stream. This local air stream transfers heat from the heatsink to the air inside the system. However, moving heat to the system air is only half the task. Sufficient system airflow is also needed in order to exhaust the air. Without a steady stream of air through the system, the fan heatsink will recirculate warm air, and therefore may not cool the processor adequately. System Airflow System airflow is determined by the following: Chassis design Chassis size Location of chassis air intake and exhaust vents Power supply fan capacity and venting Location of the processor slot(s) Placement of add-in cards and cables System integrators must ensure airflow through the system to allow the fan heatsink to work effectively. Proper attention to airflow when selecting subassemblies and building PCs is important for good thermal management and reliable system operation. Integrators use three basic chassis form factors for desktop systems: ATX, microATX, and the older Baby AT form factor. In systems using Baby AT components, airflow is usually from front to back. Air enters the chassis from vents at the front and is drawn through the chassis by the power supply fan. The power supply fan exhausts the air through the back of the chassis. Figure 1 and Figure 2 show the airflow through Baby AT systems. Figure 1. System Airflow Through Baby AT Desktop Chassis (Top View) Figure 2. System Airflow Through Baby AT Tower Chassis (Side View) Intel recommends the use of ATX and microATX form factor motherboards and chassis for boxed processors. The ATX and microATX form factors simplify assembly and upgrading of desktop systems, while improving the consistency of airflow to the processor. With regard to thermal management, ATX components differ from Baby AT components in that the processor is located close to the power supply, rather than to the front panel of the chassis. Power supplies that blow air out of the chassis provide proper airflow for active fan heatsinks. The boxed processor's active fan heatsink cools the processor more effectively when combined with an exhausting power supply fan. Because of this, the airflow in systems using the boxed processor should flow from the front of the chassis, directly across the motherboard and processor, and out of the power supply exhaust vents. Figure 3 shows proper airflow through an ATX system to achieve the most effective cooling for a boxed processor with an active fan heatsink. For boxed processors, chassis that conform to the ATX Specification Revision 2.01 or later are highly recommended. For more information on the ATX form factor, and a list of ATX chassis manufacturers, please visit the ATX Web site. Figure 3. System Airflow Through ATX Tower Chassis Optimized For the Boxed Processor With an Active Fan Heatsink One of the ways microATX chassis differ from ATX chassis is that the power supply location and type may vary. Thermal management improvements that apply to ATX chassis will also apply to microATX. For more information on the microATX form factor, and a list of microATX chassis manufacturers, please visit the microATX* web site. The following is a list of guidelines to be used when integrating a system. Specific mention of Baby AT, ATX, or microATX components is made where necessary. Chassis vents must be functional and not excessive in quantity Integrators should be careful not to select chassis that contain cosmetic vents only. Cosmetic vents are designed to look like they allow air into the chassis but no air (or little air) actually enters. Chassis with excessive air vents should also be avoided. For example, if a Baby AT chassis has large air vents on all sides; most air enters near the power supply and then immediately exits through the power supply or nearby vents. Very little air flows over the processor and other components. In ATX and microATX chassis, I/O shields must be present. Otherwise, the I/O opening may provide for excessive venting. Vents must be properly located Systems must have properly located intake and exhaust vents. The best location for vents will allow air to enter the chassis and flow on a path through the system that is over various components and directly over the processor. Specific location of vents depends upon the type of chassis. For most desktop Baby AT systems, the processor is located near the front, and thus intake vents on the front panel work best. For Baby AT tower systems, vents on the bottom of the front panel work best. For ATX and microATX systems, vents should be located both in the bottom front and bottom rear of the chassis. Also for ATX and microATX systems, I/O shields must be present to allow the chassis to vent air as designed. Lack of an I/O shield may disrupt proper airflow or circulation within the chassis. Power Supply Airflow Direction It is important to choose a power supply that has a fan that draws air in the proper direction. For most ATX and microATX systems, power supplies that act as an exhaust fan, drawing air out of the system, work most efficiently with active fan heatsinks. For most Baby AT systems, the power supply fan acts as an exhaust fan, venting system air outside the chassis. Some power supplies have markings noting airflow direction. Ensure the proper power supply is used based upon the system form factor. Power Supply Fan Strength PC power supplies contain a fan. Depending upon the type of power supply, the fan either draws air into or out of the chassis. If intake and exhaust vents are properly located, the power supply fan can draw enough air for most systems. For some chassis where the processor is running too warm, changing to a power supply with a stronger fan can greatly improve the airflow. Power Supply Venting Most, if not all, air flows through the power supply unit, which can be a significant restriction if not well vented. Choose a power supply unit with large vents. Wire finger guards for the power supply fan offer much less airflow resistance than openings stamped into the sheet metal casing of the power supply unit. It is important to make sure that floppy and hard drive cables not block the power supply air vents inside the chassis. System Fan - Should It Be Used Some chassis may contain a system fan (in addition to the power supply fan) to facilitate airflow. A system fan is typically used with passive heatsinks. With fan heatsinks, a system fan can have mixed results. In some situations, a system fan improves system cooling. However, sometimes a system fan recirculates warm air within the chassis, thereby reducing the thermal performance of the fan heatsink. When using processors with fan heatsinks, rather than adding a system fan, it is generally a better solution to change to a power supply with a more powerful fan. Thermal testing both with a system fan and without the fan will reveal which configuration is best for a specific chassis. System Fan Airflow Direction When using a system fan, ensure that it draws air in the same direction as the overall system airflow. For example, a system fan in a Baby AT system might act as an intake fan, pulling in additional air from the front chassis vents. Protect Against Hot Spots A system may have a strong airflow, but still contain "hot spots." Hot spots are areas within the chassis that are significantly warmer than the rest of the chassis air. Such areas can be created by improper positioning of the exhaust fan, adapter cards, cables, or chassis brackets and subassemblies blocking the airflow within the system. To avoid hot spots, place exhaust fans as needed, reposition full-length adapter cards or use half-length cards, reroute and tie cables, and ensure space is provided around and over the processor. Thermal Testing Differences in motherboards, power supplies, and chassis all affect the operating temperature of processors. Thermal testing is highly recommended when choosing a new supplier for motherboards or chassis, or when starting to use new products. Thermal testing can show integrators if a specific chassis-power supply-motherboard configuration provides adequate airflow for boxed processors. Testing using the proper thermal measurement tools can validate proper thermal management or demonstrate the need for improved thermal management. Verifying the thermal solution of a reference system allows integrators to minimize test time while incorporating the increased thermal demands of possible future end-user upgrades. Testing a representative system and an "upgraded" system provides confidence that a system's thermal management will be acceptable over the lifetime of the system. Upgraded systems may have extra add-in cards, graphics solutions with higher power requirements, warmer running hard drives, etc. Thermal testing should be done on each chassis-power supply-motherboard configuration using the components that dissipate the most power. Variations in processor speed, graphics solutions, etc. do not require additional thermal testing if testing is done with the highest power-dissipating configuration. Summary All desktop systems based on boxed Intel processors require thermal management. Boxed processors provide high quality fan heatsinks that provide an excellent local air stream. It is the responsibility of the integrator to ensure proper system thermal management by selecting chassis, motherboards, and power supplies that provide adequate system airflow through the system. Some specific chassis characteristics that affect system airflow include power supply fan size and strength, chassis venting, and additional system fans. Thermal testing should be done on each chassis-power supply-motherboard combination to verify the thermal management solution and ensure that the boxed processor is operating below its maximum operating temperature. Computer does not boot (has lights and/or fans, no monitor activity) Symptom: No boot Fan activity Lights No monitor activity Symptom: Important Note: Only a computer professional should assemble, disassemble, upgrade, or troubleshoot computers since the electronic devices may cause serious damage to the installer, the system, or its components if these actions are done improperly. Before attempting to disassemble or assemble computers, install components in a computer or troubleshoot computers, carefully review the documentation specific for the computer and its related components. Lastly, make sure to follow procedures to prevent damage from Electrostatic Discharge (ESD). Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem. Make sure that the monitor is plugged in and that the monitor is on. Make sure that the video cable is connected properly at the monitor and the PC. Determine if there is power light on the monitor. Most monitors will have a green light indicating it has sufficient power and is getting a video signal and an amber light if it has power but it is not getting a video signal from the computer. If you have no lights, it is most likely a problem with the monitor. Make sure that the monitor is connected to a working AC outlet, the AC power cord is plugged into the wall outlet and the monitor. If you have any on/off switches for the outlet, make sure that the switches are on. If the problem still persists, try replacing the monitor and try the monitor on another AC outlet and another system. If you have an amber light, it is most likely a problem with the computer. Check the brightness and contrast controls on the monitor. The monitor might be dimmed where you cannot see anything on the monitor. If you have a light on the monitor, use a voltmeter or an AC wall outlet tester found in a hardware store to confirm that there is adequate AC voltage at the wall outlet for the computer. If your AC outlet for your computer is connected to an on/off outlet switch, make sure that it is on. Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document. Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use. Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer. Make sure the drive ribbon cables inside the computer are attached correctly and secure. Be sure to check the orientation of pin 1 of Hard Drive. If the ribbon cable is connected backwards may cause the computer not to power up. * Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight. Check the cables that connect from the case to the motherboard. Be sure to include the power switch (PWR SW) and power LED (PWR LED). Refer to the motherboard manual for more information. Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply). Use a voltmeter to verify the PowerGood signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply. Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor. Remove the processor and RAM and reinstall them to make sure that they are installed correctly. Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much. Determine if motherboard/system has any security features, which would disable boot. If you are using RDRAM, make sure that all memory sockets of a channel are filled with either a memory chip or a continuity module. In addition, if the motherboard has multiple channels, make sure that you fill the first channel once and that you check to see which memory sockets go with each channel. Lastly, the RDRAM often has to be installed in pairs of the same type of memory chips. For example, you would have to install two sticks of 64 MB of RDRAM running at 800 MHz. If you are using SDRAM or DDR-SDRAM, some motherboards require you to populate the memory sockets starting with the first socket. Refer to your motherboard documentation for more information. If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system. If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system. If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system. Identify Products Identifying your processor What are package types? Software utility The IntelŪ Processor Frequency ID Utility was developed by Intel Corporation to enable consumers with the ability to identify and in some circumstances determine if their Intel processor is operating at the rated frequency intended by Intel Corporation. Beginning with the IntelŪ PentiumŪ III Processor, the Intel Processor Frequency ID Utility has the capability to provide actual and intended frequency, or speed, information. Web resources The Specification Update and the Product Specifications and Comparisons tool are resources which contain information about the different steppings and versions of processors. If you need information about the voltage, thermal specifications, the processor packaging, or other information about a particular Pentium III processor, you will need to view the part numbers on your processor and compare that information with the Specification Update or the Product Specifications and Comparisons tool. The Specification Update is a document that has more complete information, but the Product Specifications and Comparisons tool may be a bit easier to use. The Product Specifications and Comparisons tool was designed as a reference to help you look up technical spec information on your IntelŪ Processor. To find the information that you are looking for, you will need to know your processor's sSpec number. Package markings: flip-chip pin grid array (FC-PGA)/FC-PGA2 These markings are located on the top side of the package. On one edge, the copyright, country of origin, speed of the processor, cache size, bus speed of the processor and voltage. On the opposite edge are the FPO serialization number, production specification (sSpec) number and the branding of the processor. Refer to the Specification Update for more detailed information. The FC-PGA2 packages are similar to the FC-PGA package except the FC-PGA2 use an Integrated Heat Spreader (IHS) that covers the die. Package markings: single edge contact cartridge (S.E.C.C.) and single edge contact cartridge 2(S.E.C.C.2) The Intel Pentium III Processor's S.E.C.C. and S.E.C.C.2 cartridges have laser etched markings that indicate the processor's core speed, L2 cache size, S-spec number, serialization code, and country of origin. The markings are located on top of the cartridge. Refer to the Specification Update for more details. Processor serial number control utility overview Introduction With the introduction of the PentiumŪ III Processor, Intel has also introduced a utility that allows users to control their processor serial number. It is available on CD-ROM directly from Intel, as well being shipped with some Pentium III Processor-based systems. In keeping with its focus on user privacy, Intel will be working with other operating system vendors, such as Linux, to try and develop similar capabilities for controlling their processor's serial number. Utility overview The IntelŪ Processor serial number control utility is a Windows* program that enables or disables the reading of the Pentium III Processor serial number by software. This allows users to control which software programs or Web sites have permission to read the processor's serial number and ensures that their preference for the processor serial number setting is enforced. The default setting of the utility is to disable the reading of the processor serial number. This utility places an icon in the Windows* system tray to provide the user with a visual indication of the state of the processor serial number feature. The user has the option of hiding the system tray icon. Disabling the processor serial number can be done at anytime, but enabling the serial number requires the system to be restarted. System requirements The Intel Processor serial number control utility requires: Pentium III Processor-based system Windows* 95, Windows* 98, Windows NT* 4.0 2 megabytes of hard disk space Processor serial number questions & answers What is the IntelŪ Processor serial number? The IntelŪ processor serial number feature is embedded into the chip during the manufacturing process of the PentiumŪ III processor. The IntelŪ processor serial number serves as an identifier for the processor, and, by association, its system. Like the serial numbers on many other electronic devices or products, except the IntelŪ processor serial number is implemented electronically, rather than being placed on the exterior of the product. Why is Intel developing security features for the platform? The increased use of the Internet for communications and electronic commerce is raising PC users' concerns about the confidentiality and integrity of transaction-oriented data. Since computers are the primary connections to the Internet, they are a logical place for companies to add security features. Over the next several years, Intel is adding security building blocks in order to move the industry forward in developing secure solutions for our customers. What are the benefits of the processor serial number? In business, Corporate I.T. departments can use it to track assets and manage systems in a more efficient manner to help reduce total cost ownership. For consumers, the potential of the Internet promises new ways to shop online, manage their lives, and access and share information. Used in combination with other identifiers such as passwords and user names, hardware features such as processor serial number can provide added levels of confidence. Does the Pentium III Processor broadcast its serial number when it is enabled and a user is connected to the Internet? No. The processor serial number is passive. Thus, it does not transmit or broadcast itself. If a person chooses to enable the feature, then, when visiting a Web site that can utilize processor serial numbers, the Web site needs to send software to the PC to read the processor serial number. Is there a flaw in the PentiumŪ III Processor regarding processor serial number? No, the processor serial number feature works fine in the Pentium III processor. Some reports have erroneously stated that there was a flaw in the Pentium III processor. How do I know whether the processor serial number feature is "ON" or "OFF"? The processor serial number control utility offer users a visual indication of the state of the processor serial number feature via an icon in the Windows* system tray. Since the processor serial number utility is a standard Windows* application, users can also maximize their confidence in the reported state by following normal precautions against viruses or other malicious software. Some press reports say that once you turn the processor serial number feature OFF, it will automatically default back to ON. Is this true? No. The control utility remembers the user's preference, and it is reinstated it each time the PC boots-up. When first installed, the control utility's default is OFF, and the utility will turn the processor serial number OFF every time the PC is booted. For a user to enable the processor serial number feature, they will need to change the software setting in the control utility to ON, which will update the setting in the Windows* registry. They will then need to reboot their PC. Can the processor serial number control utility be hacked? All software can be attacked and compromised with enough time and effort. The malicious software must be downloaded or enabled for download in the browser by the user for this to happen. Note that once malicious software gets on the PC, there are a number of undesirable things that could happen -- reading personal data, financial information, downloaded e-mails, etc. That's why we strongly advise that users be careful when downloading software or executing code from unfamiliar or untrusted Web sites. Can someone else turn on the processor serial number feature remotely in my machine? Once the control utility or the BIOS switch has disabled the processor serial number feature, it cannot be turned back on without resetting the processor, which normally means rebooting the machine. The control utility is designed to default to the last user selected preference each time the system is turned on. Note that the control utility, or any software, can theoretically be affected by a virus that is allowed onto the user's system. Is it true that through a visit to the Internet, a hacker can re-enable my disabled processor serial number and read it without my knowledge or authorization? And if so, what precautions have you developed to prevent this? While it is true that all software can be attacked and compromised with enough time and effort, several events must occur to make this possible. Precautions have been implemented to help prevent those events from occurring. First, the user must download a software application onto the user's PC that will run a string of code to re-enable the disable utility switch. In most cases, your web browser will detect this software and require your permission to allow the download. However the user may not recognize this and allow the download to occur. That's why we strongly advise that users be careful when downloading software or executing code from unfamiliar or untrusted Web sites. Once disabled, the processor serial number cannot be read until the hardware processor reset has occurred. For the processor serial number to be re-enabled, there must be a hardware reset of the processor. The hardware reset can occur in several ways, as indicated in the technical information on the Technical Support area of Intel's Web site. These include: turning off and on the machine, pressing the "reset" button, or -- in the case of some PCs -- when coming out of suspend mode. Depending on the make and manufacturer, some PCs use the hardware reset during the sleep mode power-down and resume, which would enable the processor serial number without a complete system reboot. In addition, the Intel processor serial number control utility has been designed to check the state of the processor serial number and compare it to the user's designated preference. If the control utility finds that the processor serial number is "ON", yet the user setting for processor serial number is "OFF", it will turn off the processor serial number. The processor serial number will not be read. The purpose of this feature is to confirm that the icon in the system tray reflects the current state of the processor. Will Intel track each processor to know who gets which serial number? No. While this is theoretically possible to do, as part of our manufacturing process Intel will not track or correlate which processor serial numbers go to which consumers, nor will Intel entertain any offers to develop such a list. Does Intel share any of my personal information with other companies? No, Intel will not share any of your personal information without your permission, as stated in the Intel Privacy Policy. What types of applications and services will use processor serial number? Processor serial number will be used in applications that benefit from stronger forms of system and user identification, such as: Applications using security capabilities Manageability Information Management IntelŪ desktop processors package type guide This document describes the various desktop processor package types. FC-LGAx package type The FC-LGAx package is the latest package type used with the current family of desktop processors going back to the IntelŪ PentiumŪ 4 processors designed for the LGA775 socket and extending to the IntelŪ Corei7-2xxx series processors designed for the LGA1155 socket. FC-LGA is short for Flip Chip Land Grid Array x. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number x stands for the revision number of the package. This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink. You may also see references to processors in the 775-LAND or LAG775 package. This refers to the number of contacts that the package contains that interface with the LGA775 socket. Current socket types that are used with the FC-LGAx Package types are LGA775, LGA1366 and LGA1156. Sockets are not interchangeable and must be matched to motherboards for compatibility. (Motherboard BIOS support for processors is also required for compatibility.) LGA775 socket (2004) The pictures below may include the LAND Side Cover (LSC). This black cover is no longer being used. Photo examples (Front side) (Back side) LGA1366 socket (2008) Photo examples (Front side) (Back side) LGA1156 socket (2009) Photo examples (Front side) (Back side) LGA1155 socket (2011) Photo examples (Front side) (Back side) LGA1150 socket (2013) Photo examples (Front side) (Back side) FC-PGA2 package type FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins). Pentium 4 processor Photo examples (Front side) (Back side) Pentium III and IntelŪ CeleronŪ Processor Photo examples (Front side) (Back side) FC-PGA package type The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in PentiumŪ III and IntelŪ CeleronŪ processors, which use 370 pins. Photo examples (Front side) (Back side) OOI package type OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins. Photo examples (Front side) (Back side) PGA package type PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel XeonŪ processor, which has 603 pins. Photo examples (Front side) (Back side) PPGA package type PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins. Photo examples (Front side) (Back side) S.E.C.C. package type S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses gold finger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the PentiumŪ II XeonŪ and Pentium III Xeon processors, which have 330 contacts. Photo examples (Front side) (Back side) S.E.C.C.2 package type The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts). Photo examples (Front side) (Back side) S.E.P. package type S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to an S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts. Photo examples (Front side) (Back side) Product Overview (256K L2 Cache) The IntelŪ PentiumŪ III processor integrates the P6 Dynamic Execution microarchitecture, Dual Independent Bus (DIB) Architecture, a multi-transaction system bus and IntelŪ MMX media enhancement technology. In addition, the IntelŪ PentiumŪ III processor offers Internet Streaming SIMD Extensions, 70 instructions enabling advanced imaging, 3D streaming audio and video, and speech recognition for an enhanced Internet experience. Versions also include an Advanced Transfer Cache and Advanced System Buffering to meet the higher data bandwidth requirements of today's environments. With great performance for the Internet, the connected home, and multitasking environments, IntelŪ PentiumŪ III Processors are targeted at the range of mainstream consumer and business users. The IntelŪ PentiumŪ III Processor also meets the needs of entry-level workstations and servers. Product highlights The IntelŪ PentiumŪ III Processor is available at speeds ranging from 450 MHz to 1.33 GHz Versions available with either a 133 MHz or a 100 MHz system bus Versions that incorporate 256KB Advanced Transfer Cache (on-die, full-speed level 2 (L2) cache with Error Correcting Code (ECC) or versions that incorporate a discrete, half-speed, 256KB in package L2 cache with ECC Versions that incorporate Data Prefetch Logic (DPL), which anticipates the data needed by the application and pre-loads it into the Advance Transfer Cache, designed to further increase the processor and application performance 32KB (16KB/16KB) non-blocking, level 1 (L1) cache P6 Dynamic Execution microarchitecture including multiple branch prediction, data flow analysis and speculative execution Internet Streaming SIMD Extensions, consisting of 70 instructions that enable advanced imaging, 3D streaming audio and video, speech recognition and an enhanced Internet experience IntelŪ MMX media enhancement technology Dual Independent Bus (DIB) architecture increases bandwidth and performance over single-bus processors Memory cacheability up to 4GB of addressable memory space and system memory scalability up to 64GB of physical memory Both dual-processor capable and uni-processor only versions Data integrity and reliability features such as Error Correction Code, Fault Analysis and Recovery for both system and L2 cache buses Versions based upon Intels 0.13, 0.18 and 0.25 micron manufacturing processes for increased processor core frequencies and reduced power consumption Fully compatible with existing Intel Architecture-based software Product performance The IntelŪ PentiumŪ III Processor family delivers great performance. For the spectrum of IntelŪ PentiumŪ III Processor performance, please compare desktop processor specifications. Intel PentiumŪ III Processor for desktop PCs and entry-level workstations and servers The IntelŪ PentiumŪ III Processor family now includes versions up to 1.33 GHz for desktop PCs, as well as entry-level workstations and servers. All are binary compatible with previous generation Intel Architecture processors. Figure 1 summarizes the features of each currently available version. IntelŪ PentiumŪ III 256KB Processor features
    Features | 1.33, 1.20, 1.13A, 1A GHz | 1B GHz, 933, 866, 800EB, 733, 667, 600EB, 533EB MHz | 850, 800, 750, 700, 650, 600E, 550E MHz | 1.10 GHz, 1.0, 850, 800, 750, 700, 650, 600, 550E, 500E MHz | 1 GHz, 933, 866, 800, 733, 667, 600EB, 533EB MHz | 600B, 533B MHz | 450, 500, 550, 600 MHz
    S.E.C.C. 2 Package |  | X | X |  |  | X | X
    FC-PGA 370 pin Package |  |  |  | X | X |  |
    FC-PGA2 370 pin Package | X |  |  |  |  |  |
    0.13 Micron Process Technology | X |  |  |  |  |  |
    0.18 Micron Process Technology |  | X | X | X | X |  |
    0.25 Micron Process Technology | X | X |  |  | X | X |
    100 MHz System Bus |  |  | X | X |  |  | X
    256KB Level 2 Advanced Transfer Cache (full-speed) | X | X | X | X | X |  |
    512KB On-Package Half-Speed Level 2 Cache |  |  |  |  |  | X | X
    Advanced System Buffering | X | X | X | X | X |  |
    Dual Processor Support |  | X* | X | X | X | X | X
    64GB Memory Addressability | X | X | X | X | X | X | X
    4GB Memory Cacheability | X | X | X | X | X | X | X
    Streaming SIMD Extensions | X | X | X | X | X | X | X
    IntelŪ Processor Serial Number |  | X | X | X | X | X | X
    Dual Independent Bus Architecture | X | X | X | X | X | X | X
    Dynamic Execution | X | X | X | X | X | X | X
    IntelŪ MMX Media Enhancement Technology | X | X | X | X | X | X | X
    Note: `A',`E', `B' and `EB' nomenclature is used to differentiate processors within a processor speed designation when there is an overlap between processor frequencies and functionality. - A designates 0.13 micron manufacturing process - E designates Advanced Transfer Cache and Advanced System Buffering support. - B designates 133 MHz System Bus support. - EB designates Advanced Transfer Cache, Advanced System Buffering and 133 MHz System Bus support. Note: All processors greater than 600 MHz include the Advanced Transfer Cache and the Advanced System Buffering functionality. * Note: PentiumŪ III processor at 1.33, 1.20 and 1.13 GHz does not support Dual Processor. Please refer to the PentiumŪ III Processor Quick Reference Guide for dual processor capability listed by processor s-spec.
    Processor Package Options
    IntelŪ PentiumŪ III Processors are now available in three different package options: Single Edge Contact Cartridge 2 (S.E.C.C.2), Flip-Chip Pin Grid Array (FC-PGA) and Flip-Chip Pin Grid Array 2 (FC-PGA2). The FC-PGA and FC-PGA2 packages are designed for the new breed of sleek, powerful, small form factor PCs. See Figure 1 for versions available in each package type.
    P6 Dynamic Execution Microarchitecture
    | Multiple branch prediction: predicts program execution through multiple branches, accelerating the flow of work to the processor.
    | Dataflow analysis: Creates an optimized, reordered schedule of instructions by analyzing data dependencies between instructions.
    | Speculative execution: carries out instruction execution speculatively and based upon this optimized schedule, ensures that the processors superscalar execution units remain busy, boosting overall performance.
    Dual Independent Bus (DIB)
    The IntelŪ PentiumŪ III Processor supports the high-performance Dual Independent Bus (DIB) architecture. The DIB architecture places the level 2 cache on a dedicated, high speed cache bus allowing for the system bus to be freed up from cache traffic. This provides significantly higher overall system bandwidth and allows for a dramatic improvement in system performance and scalability.
    Non-Blocking Level 1 Cache
    The IntelŪ PentiumŪ III Processor includes two separate 16KB level 1 (L1) caches, one for instruction and one for data. The L1 cache provides fast access to the recently used data, increasing the overall performance of the system.
    256KB Level 2 Advanced Transfer Cache
    (Available on certain versions as specified in Figure 1) The Advanced Transfer Cache (ATC) consists of microarchitectural improvements to provide a higher data bandwidth interface between the level 2 cache and the processor core that is completely scalable with the processor core frequency. Features of the ATC include:
    | Non-Blocking, full speed, on-die level 2 cache
    | 8-way set associativity
    | 256-bit data bus to the level 2 cache
    | Reduced latency interface to cache data (as compared to discrete caches)
    Non-Blocking Level 2 Cache
    (Available on certain versions as specified in Figure 1) Certain versions of the IntelŪ PentiumŪ III Processor include a Discrete, off-die level 2 (L2) cache. This L2 cache consists of a 256KB unified, non-blocking cache that improves performance over cache-on-motherboard solutions by reducing the average memory access time and by providing fast access to recently used instructions and data. Performance is also enhanced over cache-on-motherboard implementations through a dedicated 64-bit cache bus.
    Advanced System Buffering
    (Available on certain versions as specified in Figure 1) The Advanced System Buffering consists of optimizations in the system bus buffer sizes and bus queue entries that result in an increase in the utilization of the available bandwidth on the 100 and 133 MHz system bus.
    | 4 writeback buffers
    | 6 fill buffers
    | 8 bus queue entries
    Internet Streaming SIMD Extensions
    The Internet Streaming SIMD Extensions consist of 70 instructions and includes single instruction, multiple data for floating-point, additional SIMD-integer and cacheability control instructions. Some of the benefits to desktop and Internet applications of Internet Streaming SIMD Extensions include:
    | Higher resolution and quality images can be viewed and manipulated than previously possible
    | High quality audio, MPEG2 video, and simultaneous MPEG2 encoding and decoding
    | Reduced CPU utilization for speech recognition, as well as higher accuracy and faster response times
    Up to 133 MHz System Bus
    | The system bus runs at 100 MHz or 133 MHz (available on certain versions outlined in Figure 1) allowing for a 33% increase in available bandwidth to the processor (over 100 MHz system bus)
    | The system bus supports multiple outstanding transactions to increase bandwidth availability. It also provides glueless support for up to two processors (S.E.C.C.2 package only). This enables low-cost, two-way symmetric multiprocessing, providing a significant performance boost for multi-tasking operating systems and multi-threaded applications.
    Other significant features of the IntelŪ PentiumŪ III Processor
    | A pipelined Floating-Point Unit (FPU) for supporting the 32-bit and 64-bit formats specified in IEEE standard 754, as well as an 80-bit format.
    | Parity-protected address/request and response system bus signals with a retry mechanism for high data integrity and reliability.
    Features Used for Testing and Performance Monitoring
    | Built-in Self Test (BIST) provides single stuck-at fault coverage of the microcode and large logic arrays, as well as testing of the instruction cache, data cache, Translation Lookaside Buffers (TLBs), and ROMs.
    | IEEE 1149.1 Standard Test Access Port and Boundary Scan mechanism enables testing of the Pentium III processor and system connections through a standard interface.
    | Internal performance counters for performance monitoring and event counting.
    | Incorporates an on-die diode that can be used to monitor the die temperature. A thermal sensor located on the motherboard can monitor the die temperature of the Pentium III processor for thermal management purposes.
    The IntelŪ PentiumŪ III Processor may contain design defects or errors known as errata. Current characterized errata are available upon request. Internet applications are evolving at a tremendous rate and include browser, 3D, and multimedia technologies. In attempting to evaluate processor Internet performance, PC users should consult the productivity, 3D, and multimedia benchmarks. Additionally, Java Internet technology benchmarks can be used to measure Java aspects of the Internet experience. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, reference: http://www.intel.com/products/benchmarks/desktop/index.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104. Information in this document is provided in connection with Intel products. No license, express or implied, by Intel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intels Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The IntelŪ PentiumŪ III XeonŪ Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Such errata are not covered by Intels warranty. Current characterized errata are available on request.
    Documents and Guides Integration notes The Boxed IntelŪ PentiumŪ III Processor General information Performance The IntelŪ PentiumŪ III Processor offers top performance for today and tomorrow's applications as well as quality, reliability, and compatibility from the world's leading microprocessor company. Users can expect excellent PC software performance and full compatibility with Intel Architecture-based software. Processing power is extended to allow for higher performance of business media, communication, and Internet capabilities. Web sites designed with the Intel Pentium III Processor in mind will unleash the full multimedia capabilities of the processor, which leads to an enhanced, exciting Internet experience. Technology The Intel Pentium III Processor integrates the best attributes of the P6 microarchitecture processors: Dynamic Execution, a multi-transaction system bus, and Intel MMX media enhancement technology. For an enhanced Internet experience, the Intel Pentium III Processor offers Internet Streaming SIMD Extensions, 70 new instructions enabling advanced imaging, streaming audio and video, speech recognition, and 3-D. The Intel Pentium III Processor also incorporates the processor serial number. The 96-bit serial number is accessible through the CPUID instruction and can be used by software applications to identify a system. Note: This feature can be legally disabled at the BIOS level. See the Loading a Processor Serial Number Control Utility section for more details. The Intel Pentium III Processor also incorporates Dual Independent Bus architecture. Two buses make up the Dual Independent Bus architecture: (1) L2 cache bus and (2) processor-to-main-memory system bus. The Intel Pentium III Processor can use both buses simultaneously, achieving more than two times the data in or out of the Intel Pentium III Processor than a single bus architecture processor. The system bus provides increased bandwidth for today's newer, demanding technologies, such as the Accelerated Graphics Port (AGP). The Dual Independent Bus architecture enables the closely coupled L2 cache of the Intel Pentium III Processor to run more than four times as fast as the L2 cache on Pentium processor-based systems. Finally, the pipelined system bus enables multiple simultaneous transactions (instead of singular sequential transactions), accelerating the flow of information within the system and boosting overall performance. All Intel Pentium III Processors use the Error Checking and Correction (ECC) protocol on the L2 cache bus. Since ECC protocol is a more comprehensive method of ensuring data integrity, it can detect both single-bit and double-bit errors and correct single-bit errors automatically. Platform initiatives The latest addition to the IA-32 processor line is the Intel Pentium III Processor manufactured on 0.13 micron technology. This manufacturing process technology is coupled with an on-die full-speed advanced transfer L2 cache and enables a new form factor. Boxed Intel Pentium III Processors are now available in two package options: (1) Single Edge Contact Cartridge 2 (S.E.C.C.2) and (2) Flip Chip Pin Grid Array (FC-PGA) package, and (3) Flip Chip Pin Grid Array2 (FC-PGA2) Package. The FC-PGA package is designed for the new breed of sleek, high performance, small form factor PCs. The FC-PGA2 package is an FCPGA package with the addition of an integrated heat spreader (IHS). The HIS provides improved package thermal cooling characteristics for higher speed IntelŪ PentiumŪ III Processors without having to use a larger heat sink. Table 1. Boxed IntelŪ PentiumŪ III Processor Product Feature Summary
    Core Speeds (MHz) / Versions | 1.13-1.40 GHz-S | 1.20 1.13 GHz | 1 GHz (IHS) | 1 GHz 1.0 | 933 900 866 800EB 733 667 600EB 533EB | 850 800 750 700 650 600E 550E | 600B 533B | 550E 500E | 600 550 500 450
    FC-PGA2 Package (Integrated Heat Spreader) | x | x | x |  |  |  |  |  |
    S.E.C.C.2 Package |  |  |  | x | x | x | x |  | x
    FC-PGA Package |  |  |  | x | x | x |  | x |
    0.13ĩ Process Technology | x | x |  |  |  |  |  |  |
    0.18ĩ Process Technology |  |  | x | x | x | x |  | x |
    0.25ĩ Process Technology |  |  |  |  |  |  | x |  | x
    133-MHz System Bus | x | x | x | x | x |  | x |  |
    100-MHz System Bus |  |  |  | x |  | x |  | x | x
    Dual Processing Capable | x |  | x | x | x | x | x | x |
    512KB On-Die Full-Speed L2 Cache | x |  |  |  |  |  |  |  |
    256KB On-Die Full-Speed L2 Cache |  | x |  | x | x | x |  | x |
    512KB On-Package Half-Speed L2 Cache |  |  |  |  |  |  | x |  | x
    Streaming SIMD Extensions | x | x | x | x | x | x | x | x | x
    Intel Processor Serial Number | x | x | x | x | x | x | x | x | x
    Dual Independent Bus Architecture | x | x | x | x | x | x | x | x | x
    Dynamic Execution Technology | x | x | x | x | x | x | x | x | x
    Intel MMX Media- Enhancement Technology | x | x | x | x | x | x | x | x | x
    Version Designators: | B = IntelŪ PentiumŪ III Processors that operate with a 133-MHz system bus. E = Intel Pentium III Processors that have the new on-die full-speed advanced transfer L2 cache. EB = Combination of B and E characteristics.
    The 800 EB MHz processor has a 133-MHz system bus. The 800 MHz processor has a 100-MHz system bus.
    Note | Both 800 and the 800EB have the new on-die full-speed Advanced Transfer Cache.
    The 1 GHz processor available in the S.E.C.C.2 package is only validated for use in the L440GX+ server board and has a 100-MHz system bus. The 1.0B GHz processor available in the S.E.C.C.2 package is only validated for use with a special version of the IntelŪ Desktop Board VC820 (custom VRM) and Kingston* RDRAM. It has a 133-MHz system bus.
    Integrating Boxed IntelŪ PentiumŪ III Processor-Based systems Motherboard selection Overview Motherboards used with the boxed Intel Pentium III Processor must specifically support the processor type and core speed. Some older motherboards may not support all speeds of the boxed Intel Pentium III Processor. Using a boxed Intel Pentium III Processor in a motherboard that does not support its current electrical requirements can cause permanent damage to the motherboard. Some older motherboards will require BIOS upgrades in order to properly recognize and setup the Intel Pentium III Processor. Using a Intel Pentium III Processor with the incorrect BIOS revision may cause a system to be unstable. Verify that the specific motherboard and BIOS revision will support the IntelŪ PentiumŪ III Processor. Motherboards used with Intel Pentium III Processors must meet Intel's published processor specifications. To ensure compatibility, Intel offers boxed boards for system integrators in ATX and microATX form-factor designs for use with the boxed Intel Pentium III Processor. Fan heat sink requirements The boxed Intel Pentium III Processor is delivered with a fan heat sink specially designed to provide efficient cooling in a variety of thermal environments. The fan power cable must be connected to the fan power connector and the motherboard power header as shown in the processor installation notes (included in the boxed processor package). The motherboard 3-pin power header uses two pins to supply +12V and GND. The fan uses the third pin to transmit fan-speed information to motherboards that support fan-speed detection. Your motherboard must have a 3-pin fan power header located close to the slot or socket. Refer to your motherboard manual for the location of the power header. Voltage requirements Intel Pentium III Processors are specified to operate at the voltages listed in Table 2. Table 2. Voltage Requirements for IntelŪ PentiumŪ III Processors
    Nominal Core Voltage (Volts) | Core Speed (MHz) | Form Factor | Stepping
    2.05 V | 600, 600B | S.E.C.C.2 | kC0
    2.00 V | 450, 500, 533, 550 | S.E.C.C.2 | kB0, kC0
    1.76 V | 1B GHz1,2 | FC-PGA | cC0
    1.75 V | 866, 933, 1.0 B GHz1 | FC-PGA | cD0
    1.70 V | 550E, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866, 900, 933, 1.0 B GHz1 | FC-PGA | cC0
    533EB, 550E, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866, 933, 1.0 GHz1 1.0 B GHz1 | S.E.C.C.2 | cC0
    933, 1 B GHz | FC-PGA | cB0
    933, 1 GHz1, 1.0 B GHz1 | S.E.C.C.2 | cB0
    1.65 V | 533EB, 550E, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866 | S.E.C.C.2 | cA2, cB0
    533EB, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866, 933 | FC-PGA | cA2, cB0
    550E | FC-PGA | cB0
    1.60 V | 500E | FC-PGA | cA2, cB0
    500E | FC-PGA | cA2
    1.45 V | 1.13 GHz-S, 1.20 GHz-S3, 1.40 GHz-S3 | FC-PGA2 | tA1
    1.475 V | 1.13, 1.20 GHz | FC-PGA2 | tA1
    Note that 1 GHz = 1000 MHz This only affects processors with the s-spec, SL4WM. The SL4WM s-spec has a VID request of 1.70V, however, the processor should be supplied 1.76V at the PGA Vcc pins. The IntelŪ PentiumŪ III Processor-S with 512 KB cache is designed for server platforms only. Using this processor in a desktop motherboard will cause the processor to operate out of specification and void the limited 3-year warranty for the boxed processor. Therefore, when using this processor, make sure that the motherboard is supports processors based on .13ĩ process technology and 512 KB cache. These processor should not be used with motherboards based on the Intel 440BX, 810, 815, 820 and 840.
    Caution | Verify that the motherboard supports the specific processor stepping and speed, as well as providing the required voltage.
    Proper voltage must be supplied for reliable operation. Voltage may be supplied by a regulator integrated on the motherboard, or by a voltage regulator module (VRM) installed in Header 8 on the motherboard. If the regulator is integrated on the motherboard, it must be Voltage ID (VID) programmable to allow the processor to program the correct voltage during power-on. If the motherboard has Header 8, then a VRM must be installed in the header to power the processor. Most VRMs are VID-programmable. If your motherboard has a fixed-voltage VRM, its output voltage must match the processor requirements. Since the operating voltage of Intel Pentium III Processors may change as the processor goes through stepping changes, VID-programmable voltage regulators are the preferred solution. For complete voltage specifications for Intel Pentium III Processors, refer to the IntelŪ PentiumŪ III Processor Data sheet. Chassis selection Intel encourages integrators using ATX form-factor boards. Choose a chassis that complies with the ATX specification (version 2.01 or later). A copy of the most current ATX specification appears on the Form Factor Web site. The site also lists ATX chassis manufacturers. Integrators using microATX form-factor motherboards should choose a chassis that complies with the microATX specification (version 1.0). A copy of the most current microATX specification appears on the Form Factor Web site. The site also lists microATX chassis manufacturers. In addition, Intel tests chassis for compatibility with boxed Intel Pentium III Processors and Intel Desktop Boards for system integrators. Thermal Management Considerations Thermal testing should always be performed when selecting a chassis for boxed Intel Pentium III Processor-based systems. You must use a chassis that provides sufficient airflow to keep the processor under its maximum operating temperature in the warmest user environment. Running the processor above its maximum temperature specification will void the warranty and can lead to functional and performance degradation. Intel recommends the use of ATX 2.01 or later or microATX 1.0-compliant motherboards and chassis for proper mechanical fit. The combination of the fan heat sink shipped with the boxed Intel Pentium III Processor, an ATX or microATX form-factor motherboard, and an ATX or microATX-compliant chassis can be a good thermal management solution. If you use Baby AT motherboards, be aware that the airflow varies significantly in different Baby AT chassis, depending on venting, internal brackets, and other factors. Chassis with low airflow can cause processors to exceed their maximum thermal specification. Intel's tested chassis lists contain the names of chassis that have been tested by Intel. Listed chassis provide adequate airflow and ventilation to cool boxed IntelŪ PentiumŪ III Processors when installed in typically configured systems on Intel Desktop Boards. However, additional thermal testing is necessary for each system configuration, even when using a chassis on the tested chassis list. Boxed Intel Pentium III Processor installation instructions S.E.C.C.2 package Motherboard Mechanical Requirements Motherboards supporting the boxed Intel Pentium III Processor feature a single-edge slot connector called the 242-contact slot connector. The boxed Intel Pentium III Processor in the S.E.C.C.2 package is inserted into this connector. The boxed Intel Pentium III Processor requires mechanical support called retention mechanisms. Retention mechanisms hold the processor securely in the 242-contact slot connector, and protect it and the motherboard from damage. Retention mechanisms are not included with the boxed Intel Pentium III Processor. The motherboard supplier should provide retention mechanisms and installation instructions. (All Intel Desktop Boards that support the 242-contact slot connector include retention mechanisms.) Some older motherboards may be shipped with retention mechanisms that only support the S.E.C.C. package and do not support processors in the S.E.C.C.2 package. Using a boxed Intel Pentium III Processor in the wrong retention mechanism will void the warranty. Contact the motherboard manufacturer to determine the processor support of the retention mechanisms provided with the motherboard. Figure 1. Boxed IntelŪ PentiumŪ III Processor in the S.E.C.C.2 Package (fan power cable not shown) Intel Pentium III Processor installation and removal instructions Installation and removal may vary slightly based on the retention mechanisms provided by the motherboard manufacturer. These guidelines assume the use of universal retention mechanisms. Installation into other types of retention mechanisms is similar. Motherboards shipped with retention mechanisms should have instructions on inserting the processor into the 242-contact slot connector. Intel Pentium III Processor installation steps: Install the retention mechanism(s) onto the motherboard using the motherboard manufacturer's instructions. Install the processor into the 242-contact slot connector by applying force to the top of the processor and fan heat sink. Make sure to install the heat sink into the retention mechanism and the processor substrate into the 242-contact slot connector. Do not bend the processor package. Install the processor fan cable to the motherboard connector and the fan heat sink. Power on the system and verify that the processor fan is running. Shut down system. Figure 2. Boxed IntelŪ PentiumŪ III Processor Removal Diagram Intel Pentium III Processor removal steps: Refer to Figure 2, boxed Intel Pentium III Processor removal diagram. First pull one retention mechanism away from the processor with one hand while rotating the processor out of the 242-contact slot connector with the other hand. The retention mechanisms provide firm mechanical support for the processor.
    Caution | If you find that considerable force is required to remove the processor, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis and processor package when removing the processor from the retention mechanisms. Loosening or removing one of the retention mechanisms greatly reduces the force required to remove the processor.
    Note | To loosen retention mechanisms with captive brass fasteners, simply unscrew the fastener with a screwdriver.
    Removing retention mechanisms with plastic fasteners requires the removal of the motherboard from the chassis. After the motherboard is removed and while viewing the underside of the motherboard, use the tip of a ballpoint pen or other tool to carefully push the bottom of the white pin insert out of the black plastic fastener sleeve. After the white insert pins are removed, carefully push the black sleeve portion of the fastener out of the motherboard to free the retention mechanism. FC-PGA2 package The FC-PGA2 package is an FCPGA package with the addition of an integrated heat spreader (IHS). The IHS provides improved package thermal cooling characteristics for higher speed IntelŪ PentiumŪ III Processors without having to use a larger heat sink. Besides those differences, the installation requirements are similar to the FC-PGA Package. FC-PGA package Motherboard Mechanical Requirements Motherboards supporting the boxed Intel Pentium III Processor in the FC-PGA package feature a socket called the 370-pin socket. The boxed Intel Pentium III Processor is inserted into this socket.
    Figure 3a: Boxed IntelŪ PentiumŪ III Processor in the FC-PGA Package to 933 MHz | Figure 3b: Boxed IntelŪ PentiumŪ III Processor in the FC-PGA Package at 1 GHz or greater
    Intel recommends motherboards equipped with the PGA370 socket for the boxed Intel Pentium III Processor in the FC-PGA package. The motherboard must be specifically for the Intel Pentium III Processors. However, if it is necessary to use a "slot-to-socket adapter (SSA)", follow these critical considerations and recommendations: The SSA must be recommended by the motherboard manufacturer for use with the boxed Intel Pentium III Processor and your selected motherboard. The SSA must operate the processor within Intel's electrical, mechanical, and thermal specifications. Intel does not validate SSAs for use with Intel branded boards or third-party motherboards.
    Note | Severe mechanical and electrical damage may occur to the processor, motherboard, or both if these recommendations and considerations are not carefully followed.
    4. Integrating the boxed Intel Pentium III Processor in the FC-PGA package into SSAs that are designed for the Intel Celeron processor may damage the Intel Pentium III Processor. For specific validation of any SSA with your motherboard and processor, please check with your motherboard vendor. Be aware of thermal considerations and mechanical requirements when installing any SSA. The fan heat sink included in the boxed processor package will provide sufficient cooling. However, this solution violates the maximum mechanical volumetric dimensions and weight restrictions that are recommended for motherboards with the 242-contact slot connector. Violating this recommendation will result in the SSA "leaning" to one side, which may cause broken electrical connections and interference with motherboard components. Therefore, system integrators using an SSA must follow two requirements when installing a boxed Intel Pentium III Processor. The SSA is electrically connected and mechanically held secure in the 242-contact slot connector (consider a SSA with a retention mechanism interface). No motherboard components are adversely affected by installing the boxed processor on the SSA. Figure 4. Slot-to-Socket Adapter (SSA) Installed into a Motherboard How to install and remove the fan heat sink of the boxed IntelŪ PentiumŪ III Processor For a detailed description on installing the boxed IntelŪ PentiumŪ III Processor, refer to the installation manual. IntelŪ PentiumŪ III Processor with Metal Heat sink Clip IntelŪ PentiumŪ III Processor with Plastic Heat sink Clip Intel Pentium III Processor installation steps for metal heat sink clip: Raise the handle of the 370-pin socket. Carefully install the processor into the 370-pin socket making sure that none of the pins are bent. Close the handle of the socket. Next install the fan heat sink. Make sure to install the heat sink onto the processor after the processor has been inserted into the 370-pin socket. Place the fan heat sink onto the processor so that the integrated clip lines up with the socket's attach tabs and the fan cable aligns with the PGA370 mark on the 370-pin socket.
       Caution | Take care to not damage the white thermal interface pad on the bottom of the heat sink.
    10. Locate the socket tab opposite the PGA370 mark on the socket. Latch the clip to this tab first. To attach the clip to the other socket tab, locate a standard #1, small flathead screwdriver and align with upper clip slot (Figure 5a - 'B'). Insert screwdriver into clip slot. Extend (as shown in Figure 5a - 'D') the heat sink clip away from the socket tab (Figure 5a - 'C') by rotating the screwdriver upwards toward the fan heat sink (Figure 5a - 'A'). Continue rotating the screwdriver upwards (as shown in Figure 5b - 'A') until the bottom edge of the clip clears the socket tab (Figure 5b - 'D'). Slowly push down on the clip (as shown in Figure 5b - 'B') until it is lined up with the bottom edge of the socket (Figure 5b - 'C'). Latch clip onto socket tab (Figure 5b - 'D').
        Caution | Take care to not scrape the motherboard underneath the 370-pin socket attach tabs.
    Connect the integrated fan power cable to the motherboard connector. Power on the system just long enough to verify that the processor fan operates.
    Figure 5a: Step 1 of Boxed IntelŪ PentiumŪ III Processor FC-PGA Install | Figure 5b: Step 2 of Boxed IntelŪ PentiumŪ III Processor FC-PGA Install
    6. Before removing the processor, consider removing the motherboard from the chassis. IntelŪ PentiumŪ III Processor removal steps for metal heat sink clip: Unplug the fan power cable from the motherboard's connector. Follow installation steps 5-10 in reverse order. Use a #1, small flathead screwdriver to unlatch the integrated clip from the socket's tab nearest the fan cable. Insert screwdriver into upper clip slot. Push down on the clip and simultaneously rotate the screwdriver towards the fan heat sink (see Figure 5b). After the heat sink clip is free, slowly lift the fan heat sink straight up and away from the socket and the processor. Raise the handle of the 370-pin socket, and then carefully remove the processor from the socket.
       Caution | Make sure to not bend any of the processor pins.
    6. IntelŪ PentiumŪ III Processor installation instructions for the plastic heat sink clip: Raise the handle of the 370-pin socket. Carefully install the processor into the 370-pin socket making sure that none of the pins are bent. Close the handle of the socket (A). See Fig. 6a. Align the fan heat sink clip to the socket as shown in Fig. 6a. Make sure to align the pin on the heat sink clip (B) to the hole in the fan heat sink. Align the pin hole (C) with the PGA370 mark (D) on the socket. With the clip lever in the up position, install the fan heat sink on the processor. Make sure both sides of the clip (E) are securely fastened to the socket tabs (F). Close the clip lever.
       Note | Be careful not the damage the thermal interface material when installing the heat sink onto the processor.
    Snap the fan on the heat sink as shown in Figure 6b. Connect the integrated fan power cable to the motherboard connector (G). Power on the system just long enough to verify that the processor fan operates.
    Figure 6a: Step 1 of the Installation of the FC-PGA Boxed IntelŪ PentiumŪ III Processor at 1 GHz
    Figure 6b : Step 2 of the Installation of the Boxed FC-PGA IntelŪ PentiumŪ III Processor at 1 GHz | Figure 6c: Removal of the Boxed FC-PGA IntelŪ PentiumŪ III Processor at 1 GHz
    6. IMPORTANT NOTE: If the fan is attached incorrectly, it may unlatch itself at a later time from normal jarring of the computer. If the fan detaches from the heat sink, the processor may be permanently damaged. Please refer to figure 7a and 7b for the proper fan orientation. Notice the position of the Intel hologram and fan cable relative to the heat sink clip. Figure 1 is the incorrect fan orientation and figure 2 is the proper fan orientation. Furthermore, please make sure the fan is securely fastened to the heat sink by firmly pulling on the fan. Figure 7(a) shows the incorrect orientation of the heat sink fan, while Figure 7(b) shows the correct orientation of heat sink and fan. Before removing the processor, consider removing the motherboard from the chassis. IntelŪ PentiumŪ III Processor removal steps for plastic fan heat sink clip: Intel Pentium III Processor removal steps: Unplug the fan power cable from the motherboard's connector. Remove the fan from the heat sink. Open the heat sink clip lever. Referring to Figure 6c, while holding onto the heat sink, slide (H) the heat sink (J) towards the socket tab (K) located on the cam lever side (L) of the PGA370 socket. The heat sink clip should pop free of the socket tab (K). After the heat sink clip is free, slowly lift the fan heat sink straight up and away from the socket and the processor. Raise the handle of the 370-pin socket, and then carefully remove the processor from the socket.
       Caution | Make sure to not bend any of the processor pins.
    Operating system and application support The Intel Pentium III Processor is backward compatible with Intel Architecture compatible operating systems and applications. Many of the new Internet Streaming SIMD Extensions can be used by applications on any operating system provided the operating supports the instructions being used. Many modern operating systems have support for all instructions introduced with the Internet Streaming SIMD Extensions, but this support may require installation of specific drivers. Applications that do not use the Internet Streaming SIMD Extensions will still benefit from the Intel Pentium III Processor's high-speed execution and P6 microarchitecture. Applications that use the Internet Streaming SIMD Extensions should verify proper operating system support for the extensions and may signal the installer if the operating system does not yet have the proper driver support. Integrators building systems based on the Intel Pentium III Processor should choose an operating system that supports the Internet Streaming SIMD Extensions, install any necessary drivers, and verify the operating system is prepared for applications that are optimized with the Internet Streaming SIMD Extensions. Loading a processor serial number control utility Computer system users should have control over which software or Web sites have permission to read the processor serial number from their system. This control can be provided by enabling or disabling the processor serial number in the BIOS through a setup option or in the operating system environment via a control utility. If either of these methods is set to "disabled," the processor serial number will not be available to software applications. The Intel processor serial number control utility is a program that enables or disables the reading of the processor serial number of the Intel Pentium III Processor in the Windows* 95, Windows 98 or Windows NT* operating system environments. Intel encourages system integrators to load a processor serial number control utility onto every Intel Pentium III Processor-based system built. Dual processor system considerations Intel Pentium III Processors are tested during manufacturing to ensure they will work in dual-processor configurations with processors of the same speed. Operation with different speed processors is not prohibited, but is not tested by Intel. Intel tests dual processor configurations with different steppings of the Intel Pentium III Processor as new processor steppings are introduced. For more information, see Mixing Processor Steppings below. Intel still recommends using processors of the same stepping when integrating dual processor systems. Recommendations for integration of dual processor systems Ship dual-processor systems with both processors installed to ensure that processor speeds and steppings are the same. When partially populated systems are shipped, a customer returning for additional processors may have difficulty locating a processor with the same stepping. If this occurs, the customer may have to replace the original processor to obtain a system with two processors of the same stepping. If a system is shipped with only one processor installed, first test the system with both processors installed. This will demonstrate whether the motherboard will support dual-processor operation. Provide customers with the speed and stepping information of the original processor in these systems and make sure they understand the importance of having processors of the same speed and stepping. Warn customers of the risk of having to replace the original processor in the future if earlier stepping processors are not available. If a system is shipped with only one processor, install the operating system with two processors installed. Some operating systems will install different kernel versions, depending on the number of processors present. The second processor can then be removed before system shipment. This technique alleviates the need to reinstall the operating system if a second processor is added later. Integrators that want to mix processor steppings within a dual-processor system should first read Mixing Processor Steppings below for an overview of the issues involved. Matching processor steppings The easiest way to match steppings is to compare the 5-character test specification numbers on the top of IntelŪ PentiumŪ III Processors. The number starts with an "S" and is followed by 4 characters (for example, "SL3CC"). Boxed Intel Pentium III Processors have the test specification number also printed on the box label. Identical silicon steppings may sometimes be shipped with different test specification numbers, depending on whether they are for OEMs or for system integrators. Some Intel boxed processors may have OEM test specification numbers. Mixing processor steppings Even though Intel recommends using identical processor steppings in multiprocessor systems whenever possible (as this is the only configuration which receives Intel's full testing), Intel supports mixing processor steppings, and does not actively prevent various steppings of the Intel Pentium III Processor from working together in dual-processor systems. However, since Intel cannot test every possible combination of devices, each new stepping of a device is fully tested only against the latest steppings of other processors and chipset components. With mixed stepping configurations, all processors must be run at an identical frequency. The workaround for various errata must take all processors into account. Errata for the Intel Pentium III Processor are published in the IntelŪ PentiumŪ III Processor Specification Update. Errata for all processor steppings present in a system will affect that system, unless worked around. Due to the variety of motherboard vendors in the market and the number of system BIOS revisions, some system-level issues may occur that lie outside the realm of any mixed stepping evaluation performed by Intel. Recommendations for shipping systems that mix Intel Pentium III Processor steppings are as follows: Choose a motherboard vendor with a history of dual-processor experience. Contact your motherboard vendor for information on mixed stepping validation performed on your particular dual processor motherboard. Refer to the IntelŪ PentiumŪ III Processor Specification Update for information on processor errata, their workarounds, and potential performance issues before integrating dual processor systems. The specification update can be obtained from Intel's Developer Site. Thermal management for IntelŪ PentiumŪ III processors Introduction Systems using IntelŪ PentiumŪ III Processors all require thermal management. It is assumed that the reader has a general knowledge of and experience with PC operation, integration, and thermal management. Integrators who follow the recommendations presented here can provide their customers with more reliable PCs and will see fewer customers returning with problems. (The term "boxed Pentium III Processors" refers to processors packaged for use by system integrators.) Allowing processors to operate at temperatures beyond their maximum specified operating temperature will lessen the lifetime of the processor and can cause unreliable operation. It is critical when building quality systems using the boxed Pentium III processor to carefully consider the thermal management of the system and verify the system design with thermal testing. This document details specific thermal requirements of the boxed Pentium III processor. System integrators using the boxed Pentium III processor should become familiar with this document as well as the two listed below. Thermal management The term "thermal management" refers to two major elements: a heatsink properly mounted to the processor, and effective airflow through the system chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature. Proper thermal management is achieved when heat is transferred from the processor to the system air, which is then vented out of the system. Boxed Pentium III processors are shipped with an attached high-quality fan heatsink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure adequate system airflow. Fan heatsink The fan heatsink that ships with the boxed Pentium III processor has already been securely attached to the processor. Thermal interface material (already applied) provides effective heat transfer from the processor to the fan heatsink. The fan cable provides power to the fan by connecting to a motherboard-mounted power header and also allows the fan to provide fan speed information to the motherboard. (Only motherboards with hardware monitoring circuitry can use the fan speed signal.) The fan is a high-quality ball bearing fan that provides a good local air stream. This local air stream transfers heat from the heatsink to the air inside the system. However, moving heat to the system air is only half the task. Sufficient system airflow is also needed in order to exhaust the air. Without a steady stream of air through the system, the fan heatsink will re-circulate warm air that may not cool the processor adequately. Chassis recommendations Intel recommends the use of ATX and microATX form factor motherboards and chassis for the boxed Pentium III processor. The ATX and microATX form factors simplify assembly and upgrading of PCs, while improving the consistency of airflow to the processor. For more information, see System Thermal Management for Boxed Intel Processor-Based Desktop PCs. Pentium III Processor thermal recommendations Table 1 also shows the power dissipation for boxed Pentium III processors. Processors that dissipate more power will also generate more heat. Use the thermal test methodology described in Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs to test thermal management of boxed Pentium III processor-based systems. When building 242-contact slot connector systems that will feature boxed Pentium III processors, testing should be performed using the 600-MHz or a 600B-MHz processor because it dissipates the most power. When building 370-pin socket systems that will feature boxed Pentium III processors, testing should be performed using the 550E-MHz processor because it dissipates the most power. To determine the temperature of the processor core per the specification, use the thermal methodology described in AP-905 Pentium III Processor Thermal Design Guidelines (order #245087). The process this document describes involves purchasing an evaluation kit and using the processor's thermal diode. Table 1. PentiumŪ III Processor Thermal Specifications 1
    Processor Frequency | Form Factor | Temperatures | Total Max Processor Power
    Max Core (TJ) | Max Plate (TCASE) | Fan Inlet (TA)3 | Heatsink Base (THS)5
    1.40 GHz- S 7 | FC-PGA2 | N/A | 69°C | 45°C | N/A 5 | 31.2 W
    1.26 GHz- S 7 | FC-PGA2 | N/A | 69°C | 45°C | N/A 5 | 29.5 W
    1.20 GHz 7 | FC-PGA2 | N/A | 69°C | 45°C | N/A 5 | 29.9 W
    1.13 GHz-S 7 | FC-PGA2 | N/A | 69°C | 45°C | N/A 5 | 27.9 W
    1.13 GHz 7 | FC-PGA2 | N/A | 69°C | 45°C | N/A 5 | 29.1 W
    1 GHz | FC-PGA2 | N/A | N/A | 45°C | N/A 5 | 29.0 W
    1 GHz | FC-PGA | 70°C 2 | N/A | 45°C | N/A 5 | 30.0 W
    1 GHz | FC-PGA | 70°C 2 | N/A | 45°C | N/A 5 | 26.1 W
    9335 MHz | FC-PGA | 77°C 2 | N/A | 45°C | N/A 5 | 28.3 W
    933 MHz | S.E.C.C.2 | 75°C 2 | N/A | 45°C | N/A 5 | 25.5 W
    933 MHz | FC-PGA | 75°C 2 | N/A | 45°C | N/A 5 | 24.5 W
    900 MHz | FC-PGA | 75°C 2 | N/A | 45°C | N/A 5 | 23.2 W
    8665 MHz | FC-PGA | 80°C 2 | N/A | 45°C | N/A 5 | 27.1 W
    866 MHz | S.E.C.C.2 | 80°C 2 | N/A | 45°C | N/A 5 | 22.9 W
    866 MHz | FC-PGA | 80°C 2 | N/A | 45°C | N/A 5 | 22.9 W
    850 MHz | S.E.C.C.2 | 80°C 2 | N/A | 45°C | N/A 5 | 22.5 W
    850 MHz | FC-PGA | 80°C 2 | N/A | 45°C | N/A 5 | 22.5 W
    800EB MHz | S.E.C.C.2 | 80°C 2 | N/A | 45°C | N/A 5 | 20.8 W
    800EB MHz | FC-PGA | 80°C 2 | N/A | 45°C | N/A 5 | 20.8 W
    800 MHz | S.E.C.C.2 | 80°C 2 | N/A | 45°C | N/A 5 | 20.8 W
    800 MHz | FC-PGA | 80°C 2 | N/A | 45°C | N/A 5 | 20.8 W
    750 MHz | S.E.C.C.2 | 80°C 2 | N/A | 45°C | N/A 5 | 19.5 W
    750 MHz | FC-PGA | 80°C 2 | N/A | 45°C | N/A 5 | 19.5 W
    733 MHz | S.E.C.C.2 | 80°C 2 | N/A | 47°C | N/A 5 | 19.1 W
    733 MHz | FC-PGA | 80°C 2 | N/A | 47°C | N/A 5 | 19.1 W
    700 MHz | S.E.C.C.2 | 80°C 2 | N/A | 47°C | N/A 5 | 18.3 W
    700 MHz | FC-PGA | 80°C 2 | N/A | 47°C | N/A 5 | 18.3 W
    667 MHz | S.E.C.C.2 | 82°C 2 | N/A | 50°C | N/A 5 | 17.5 W
    667 MHz | FC-PGA | 82°C 2 | N/A | 50°C | N/A 5 | 17.5 W
    650 MHz | S.E.C.C.2 | 82°C 2 | N/A | 53°C | N/A 5 | 17.0 W
    650 MHz | FC-PGA | 82°C 2 | N/A | 53°C | N/A 5 | 17.0 W
    600EB MHz | S.E.C.C.2 | 82°C 2 | N/A | 48°C | N/A 5 | 15.8 W
    600EB MHz | FC-PGA | 82°C 2 | N/A | 48°C | N/A 5 | 15.8 W
    600E MHz | S.E.C.C.2 | 82°C 2 | N/A | 48°C | N/A 5 | 15.8 W
    600E MHz | FC-PGA | 82°C 2 | N/A | 48°C | N/A 5 | 15.8 W
    600B MHz | S.E.C.C.2 | 85°C 2 | N/A | 45°C | 60°C | 34.5 W
    600 MHz | S.E.C.C.2 | 85°C 2 | N/A | 45°C | 60°C | 34.5 W
    550E MHz | S.E.C.C.2 | 85°C 2 | N/A | 50°C | N/A 5 | 14.5 W
    550E MHz | FC-PGA | 85°C 2 | N/A | 50°C | N/A 5 | 14.5 W
    550 MHz | S.E.C.C.2 | 80°C 2 | N/A | 45°C | 60°C | 30.8 W
    533EB MHz | S.E.C.C.2 | 82°C 2 | N/A | 50°C | N/A 5 | 14.0 W
    533EB MHz | FC-PGA | 82°C 2 | N/A | 50°C | N/A 5 | 14.0 W
    533B MHz | S.E.C.C.2 | 90°C 2 | N/A | 47°C | 61°C | 29.7 W
    500E MHz | FC-PGA | 85°C 2 | N/A | 53°C | N/A 4 | 13.2 W
    500 MHz | S.E.C.C.2 | 90°C 2 | N/A | 50°C | 62°C | 28.0 W
    450 MHz | S.E.C.C.2 | 90°C 2 | N/A | 53°C | 65°C | 25.3 W
    The maximum operating temperature and maximum power specification are specifications from the processor datasheet. The recommended fan inlet temperature (TAM) and the recommended heatsink base temperature (THS) are not specification, see note 3 and 4. For more information on Pentium III processor specifications, see the Pentium III Processor Datasheet. The junction temperature (TJ) can be determined using the thermal diode in the processor core. For more information, see the AP-905 Pentium III Processor Thermal Design Guidelines (order # 245087). The recommended fan inlet temperature (TA) should be measured at the inlet of the fan heatsink on the boxed processor (see Figure 1 and 3). This is a maximum value and a recommendation only, not a specification. The recommended heatsink base temperature (THS) should be measured at the center of the top of the heatsink base near the processor markings (see Figure 1). This is a maximum value and a recommendation only, not a specification. This method of validation is not appropriate for processors in the socketed form factor. This part has a Vcc of 1.75 volts. This processor is manufactured on the 0.13 micron process. A simple evaluation of the temperature of the heatsink base can provide confidence in the system's thermal management. For boxed Pentium III processors in the S.E.C.C.2 form factor, the testing point is at the center of the heatsink base on the top of the processor near to the processor marking area (see Figure 1). The document titled Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs describes how to determine the temperature of this location while running a high power application. Using this evaluation, it is possible to determine if a system has sufficient thermal management for the boxed processor. A more general evaluation can be done by testing the temperature of the air entering the fan inlet. Table 1 contains the recommended temperature that the heatsink base test point or the air inlet temperature should remain below during the thermal evaluation of a system. Figure 1. Temperature Test Locations for Boxed Pentium III Processors in the S.E.C.C.2 Form Factor For boxed Pentium III processors in the FC-PGA package, the testing point is 0.3 inches above the center of the fan inlet. (see Figure 2). Figure 2. FC-PGA Boxed PentiumŪ III Processors Temperature Test Locations Fahrenheit to celsius conversion chart
    ° F | ° C | ° F | ° C | ° F | ° C | ° F | ° C
    59.0 | 15 | 89.6 | 32 | 120.2 | 49 | 150.8 | 66
    60.8 | 16 | 91.4 | 33 | 122.0 | 50 | 152.6 | 67
    62.6 | 17 | 93.2 | 34 | 123.8 | 51 | 154.4 | 68
    64.4 | 18 | 95.0 | 35 | 125.6 | 52 | 156.2 | 69
    66.2 | 19 | 96.8 2 | 36 | 127.4 | 53 | 158.0 | 70
    68.0 | 20 | 98.6 | 37 | 129.2 | 54 | 159.8 | 71
    69.8 | 21 | 100.4 | 38 | 131.0 | 55 | 161.6 | 72
    71.6 1 | 22 | 102.2 | 39 | 132.8 | 56 | 163.4 | 73
    73.4 | 23 | 104.0 | 40 | 134.6 | 57 | 165.2 | 74
    75.2 | 24 | 105.8 | 41 | 136.4 | 58 | 167.0 | 75
    77.0 | 25 | 107.6 | 42 | 138.2 | 59 | 168.8 | 76
    78.8 | 26 | 109.4 | 43 | 140.0 3 | 60 | 170.6 | 77
    80.6 | 27 | 111.2 | 44 | 141.8 | 61 | 172.4 | 78
    82.4 | 28 | 113.0 | 45 | 143.6 | 62 | 174.2 | 79
    84.2 | 29 | 114.8 | 46 | 145.4 | 63 | 176.0 | 80
    86.0 | 30 | 116.6 | 47 | 147.2 | 64 |  |
    87.8 | 31 | 118.4 | 48 | 149.0 | 65 |  |
    Typical office room temperature. Typical maximum operating room temperature for a system in an air-conditioned environment. Typical maximum operating room temperature for a system in a non-air-conditioned environment.
    Datasheets for IntelŪ PentiumŪ III Processors IntelŪ PentiumŪ III Processor with 512-KB L2 Cache at 1.13GHz to 1.40 GHz Datasheet The Intel Pentium III processor with 512-KB L2 Cache is designed for high-performance workstations and servers. The Intel Pentium III processor with 512-KB L2 Cache, like its predecessors in the P6 family of processors, implements a Dynamic Execution microarchitecture - a unique combination of multiple branch prediction, data flow analysis, and speculative execution. This enables these processors to deliver higher performance than the IntelŪ PentiumŪ processor, while maintaining binary compatibility with all previous IntelŪ Architecture processors. The processor also executes IntelŪ MMX technology instructions for enhanced media and communication performance just as its predecessor, the Intel Pentium III processor (CPUID = 068xh). Additionally, the Intel Pentium III processor with 512-KB L2 Cache executes Streaming SIMD (single-instruction, multiple data) Extensions for enhanced floating point and 3-D application performance. Data Prefetch Logic adds functionality that anticipates the data needed by the application and pre-loads it into the Advanced Transfer Cache, further increasing processor and application performance. The processor utilizes multiple low-power states such as Sleep, and Deep to conserve power during idle times.
    | IntelŪ PentiumŪ III Processor with 512-KB L2 Cache at 1.13GHz to 1.40 GHz Datasheet
    | File Name: 24965705.pdf Size: 1817782 bytes
    IntelŪ PentiumŪ III Processor Based on 0.13 Micron Process Up to 1.33 GHz Datasheet The IntelŪ PentiumŪ III processor on 0.13 micron process for the PGA370 socket is the next member of the P6 family in the Intel IA-32 processor line. The IntelŪ PentiumŪ III processor on 0.13 micron process will continue in the package technology called flip-chip pin grid array but will contain a Integrated Heat Spreader (IHS]. The flip-chip with IHS package will be labeled as FC-PGA2 and will utilize the same 370-pin zero insertion force socket (PGA370). Thermal solutions contact the IHS directly for the FC-PGA2 package and not to the bare-die as with the FC-PGA attachment.
    | IntelŪ PentiumŪ III Processor Based on 0.13 Micron Process Up to 1.33 GHz Datasheet
    | File Name: 24976503.pdf Size: 1549807 bytes
    IntelŪ PentiumŪ III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz The IntelŪ PentiumŪ III processor for the PGA370 socket is the next member of the P6 family, in the IntelŪ IA-32 processor line and hereafter will be referred to as the PentiumŪ III processor, or simply the processor. The processor uses the same core and offers the same performance as the Intel Pentium III processor for the SC242 connector, but utilizes a package technology called flip-chip pin grid array, or FC-PGA. This package utilizes the same 370-pin zero insertion force socket (PGA370) used by the IntelŪ CeleronŪ processor. Thermal solutions are attached directly to the processor core package for FC-PGA and FC-PGA2.
    | IntelŪ PentiumŪ III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
    | File Name: 24526408.pdf Size: 1039043 bytes
    IntelŪ PentiumŪ III Processor for the SC242 at 450 MHz to 1.0 GHz Datasheet The IntelŪ PentiumŪ III processor is the next member of the P6 family in the IntelŪ IA-32 processor line. Like the IntelŪ PentiumŪ II processor, the Intel Pentium III processor implements the Dynamic Execution microarchitecture - a unique combination of multiple branch prediction, data flow analysis, and speculative execution. This enables these processors to deliver higher performance than the Intel Pentium processor, while maintaining binary compatibility with all previous IntelŪ architecture processors. The Pentium III processor also executes IntelŪ MMX technology instructions for enhanced media and communication performance just as its predecessor, the Intel Pentium II processor. The Intel Pentium III processor executes Internet Streaming SIMD Extensions for enhanced floating-point and 3-D application performance. In addition, the Intel Pentium III processor extends the concept of processor identification with the addition of a processor serial number. Refer to the Intel Processor Serial Number application note (Document Number 245125) for more detailed information. The Intel Pentium III processor utilizes multiple low-power states such as AutoHALT, Stop-Grant, Sleep, and Deep Sleep to conserve power during idle times.
    | IntelŪ PentiumŪ III Processor for the SC242 at 450 MHz to 1.0 GHz Datasheet
    | File Name: 24445209.pdf Size: 1640152 bytes
    Low Voltage IntelŪ PentiumŪ III Processor 512-KB Using Intel's advanced 0.13-micron process technology with copper interconnect, the Low Voltage (LV) IntelŪ PentiumŪ III processor 512-KB offers high-performance and low-power consumption. Key performance features include Internet Streaming SIMD instructions, an Advanced Transfer Cache architecture, and a processor system bus speed of up to 133 MHz. These features are offered in a Micro-FCBGA package for surface mount boards. All of these technologies make outstanding performance possible for applied computing applications. This document provides the electrical, mechanical, and thermal specifications for the LV Intel Pentium III processor 512-KB in the Micro-FCBGA package at 1 GHz/133 MHz (1.15V), 933/133 MHz (1.15 V), and 800/133 MHz (1.15 V).
    | Low Voltage IntelŪ PentiumŪ III Processor 512-KB
    | File Name: 27367305.pdf Size: 1257656 bytes
    Application notes
    | Thermal Airflow Considerations SECC2 OLGA HEAT SINK COOLING IN AN ATX CHASSIS [PDF]
    | File Name: 24513901.pdf Size: 74,431 bytes Date: February 1999
    Specification updates
    | IntelŪ PentiumŪ III Processor Specification Update [PDF]
    | File Name: 24445358.pdf Size: 430,130 bytes Date: August 2008
    Technical Notes Voltage Requirements for IntelŪ PentiumŪ III processors IntelŪ PentiumŪ III Processors are specified to operate at the voltages provided in the table below. It is important to verify that the motherboard explicitly supports the specific processor (by stepping and speed). Voltage requirements for IntelŪ Pentium III Processors
    Nominal Core Voltage (Volts) | Core Speed (MHz) | Form Factor | Stepping
    2.05 V | 600, 600B | S.E.C.C.2 | kC0
    2.00 V | 450, 500, 533, 550 | S.E.C.C.2 | kB0, kC0
    1.76 V | 1B GHz1,2 | FC-PGA | cC0
    1.75 V | 866, 933, 1.0 B GHz1 | FC-PGA | cD0
    1.70 V | 550E, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866, 900, 933, 1 B GHz1 | FC-PGA | cC0
    533EB, 550E, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866, 933, 1 GHz1, 1B GHz1 | S.E.C.C.2 | cC0
    933, 1 B GHz1 | FC-PGA | cB0
    933, 1 GHz1, 1B GHz1 | S.E.C.C.2 | cB0
    1.65 V | 533EB, 550E, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866 | S.E.C.C.2 | cA2, cB0
    533EB, 600E, 600EB, 650, 667, 700, 733, 750, 800, 800EB, 850, 866, 933 | FC-PGA | cA2, cB0
    550E | FC-PGA | cB0
    1.60 V | 500E | FC-PGA | cA2, cB0
    500E | FC-PGA | cA2
    1.475 V | 1.13, 1.20 GHz | FC-PGA2 | tA1
    1.45 V | 1.13-S, 1.26-S, 1.40-S GHz | FC-PGA2 | tA1
    Note that 1 GHz = 1000 MHz. This only affects processors with the s-spec, SL4WM. The SL4WM s-spec has a VID request of 1.70V, however, the processor should be supplied 1.76V at the PGA Vcc pins. The -S version of the Pentium III processor requires VRM 8.5. Proper voltage must be supplied for reliable operation. It may be supplied by a regulator integrated in the motherboard, or by a voltage regulator module (VRM) installed in Header 8 on the motherboard. If the regulator is integrated in the motherboard, it must be Voltage ID (VID) programmable to allow the processor to program the correct voltage during power-on. If the motherboard has Header 8, a VRM must be installed in the header to power the processor. Most VRMs are VID-programmable. If your motherboard has a fixed-voltage VRM, its output voltage must match the processor requirements. Since the operating voltage of IntelŪ PentiumŪ III Processors may be changed as the processor goes through stepping changes, VID-programmable voltage regulators are the preferred solution. For complete voltage specifications for IntelŪ PentiumŪ III Processors, refer to the IntelŪ Pentium III Processor Datasheet for the appropriate package type of the processor. IntelŪ microprocessor export compliance metrics Intel Corporation 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 USA Global Trade Department e-mail inquiries to: ctp.determinations@intel.com Following are the Gigaflops (GFLOPS), Composite Theoretical Performance (CTP), and Adjusted Peak Performance (APP) values for Intels 32-bit and 64-bit processors. All IntelŪ 8-bit and 16-bit processors and microcontrollers with a clock speed exceeding 25 MHz are 3A991, with the exception of those encapsulated in military packages that have been tested to the Mil-883C temperature specifications. All Intel 8-bit and 16-bit processors and microcontrollers with a clock speed of 25 MHz or less are EAR99. On November 5, 2007, the United States Department of Commerces Bureau of Industry and Security (BIS) published amendments to the Export Administration Regulations 15 CFR, which resulted in the inclusion of the December 2006 Wassenaar Arrangement Plenary Agreement Implementation. The amendments introduced a new metric, Gigaflops (GFLOPS), to measure processor performance for export purposes. BIS no longer requires exporters to determine the CTP. However, CTP values will still be provided for those customers located in countries where the CTP is still required as a measurement of processor performance for export compliance purposes. CTP calculations are based upon a modified formula resulting from Wassenaar negotiations on December 21, 1993, and published in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4), and are stated in Millions of Theoretical Operations Per Second (MTOPS). APP calculations are based on the formula published in the United States Department of Commerce Export Administration Regulations 71 CFR 20876, and are stated in Weighted Teraflops (WT). All GFLOPS, CTP and APP calculations contained herein were based on specifications taken from Intel datasheets and are subject to change without notice. Intel makes no representation or warranty as to the accuracy or reliability of such specifications. THESE CALCULATIONS ARE PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Intel disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information in these calculations. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
    Processor Number | Clock Speed | CTP in MTOPS | GFLOPS | APP in WT
    1 Way | 2 Way | 4 Way
    N/A | 1.40 GHz | 3266.67 | 2.8 | 0.00084 | 0.00168 | 0.00336
    N/A | 1.26 GHz | 2940 | 2.52 | 0.000756 | 0.001512 | 0.003024
    N/A | 1.13 GHz | 2636.667 | 2.26 | 0.000678 | 0.001356 | 0.002712
    N/A | 1 GHz | 2333.451 | 2 | 0.0006 | 0.0012 | 0.0024
    N/A | 933 MHz | 2177.109 | 1.87 | 0.00056 | 0.00112 | 0.002239
    N/A | 900 MHz | 2100.105 | 1.8 | 0.00054 | 0.00108 | 0.00216
    N/A | 866 MHz | 2020.768 | 1.73 | 0.00052 | 0.001039 | 0.002078
    N/A | 850 MHz | 1983.433 | 1.7 | 0.00051 | 0.00102 | 0.00204
    N/A | 800 MHz | 1866.76 | 1.6 | 0.00048 | 0.00096 | 0.00192
    N/A | 750 MHz | 1750.088 | 1.5 | 0.00045 | 0.0009 | 0.0018
    N/A | 733 MHz | 1710.419 | 1.47 | 0.00044 | 0.00088 | 0.001759
    N/A | 700 MHz | 1633.415 | 1.4 | 0.00042 | 0.00084 | 0.00168
    N/A | 667 MHz | 1556.411 | 1.33 | 0.0004 | 0.0008 | 0.001601
    N/A | 650 MHz | 1516.743 | 1.3 | 0.00039 | 0.00078 | 0.00156
    N/A | 600 MHz | 1400.07 | 1.2 | 0.00036 | 0.00072 | 0.00144
    N/A | 550 MHz | 1283.398 | 1.1 | 0.00033 | 0.00066 | 0.00132
    N/A | 533 MHz | 1243.729 | 1.07 | 0.00032 | 0.00064 | 0.001279
    N/A | 500 MHz | 1166.725 | 1 | 0.0003 | 0.0006 | 0.0012
    N/A | 450 MHz | 1050.053 | 0.9 | 0.00027 | 0.00054 | 0.00108
    N/A | 400 MHz | 933.38 | 0.8 | 0.00024 | 0.00048 | 0.00096
    These products are no longer supported via phone, e-mail, or chat The following older processor families are no longer supported through interactive support such as phone, e-mail, or chat. Intel will maintain information for these processors on our web site. You can access these processor family Web sites by clicking on the links under the processor column.
    Processor | End of interactive support (EOIS) | Additional description
    Mobile IntelŪ PentiumŪ 4 Processors - M | November 8th, 2008 | All
    IntelŪ Processor Frequency ID Utility | November 8th, 2008 | All
    IntelŪ PentiumŪ Processors Extreme Edition | November 8th, 2008 | All
    IntelŪ PentiumŪ D Processors | November 8th, 2008 | All
    IntelŪ PentiumŪ 4 Processors Extreme Edition | November 8th, 2008 | All
    IntelŪ PentiumŪ 4 Processors Extreme Edition supporting HT Technology | November 8th, 2008 | All
    IntelŪ PentiumŪ 4 Processors | November 8th, 2008 | All
    IntelŪ CeleronŪ D Processors | November 8th, 2008 | All
    IntelŪ CeleronŪ Processors | November 8th, 2008 | All 478-pin package
    December 1st, 2004 | All FCPGA & FCPGA2 packages
    December 1st, 2004 | All 370-pin package
    June 14th, 2002 | All PPGA & SEPP packages
    Still supported | [E3000, E1000 & 400 Series are still supported]
    IntelŪ PentiumŪ III XeonŪ Processors | December 1st, 2004 | All
    IntelŪ PentiumŪ III Processors | December 1st, 2004 | All
    Mobile IntelŪ PentiumŪ III Processors | December 1st, 2004 | All
    IntelŪ PentiumŪ II XeonŪ Processors | June 14th, 2002 | All
    IntelŪ PentiumŪ II Processors | June 14th, 2002 | All
    Mobile IntelŪ PentiumŪ II Processors | December 1st, 2004 | All
    IntelŪ PentiumŪ Pro Processors | October 17th, 2000 | All
    IntelŪ PentiumŪ Processors with MMX Technology | October 17th, 2000 | All
    IntelŪ PentiumŪ Processors | October 17th, 2000 | All
    IntelŪ PentiumŪ Mobile Processors | October 17th, 2000 | All
    IntelŪ OverDriveŪ Processors | October 17th, 2000 | All
    Intel486 Processors | December 1st, 2004 | All
    Intel386 Processors | December 1st, 2004 | All
    Floating Point Unit (FPU) exception handlers for IntelŪ Architecture (IA) Floating Point Unit (FPU) exception hander information for IntelŪ processors is available in the following documents: Application note AP-578, Software and Hardware Considerations for FPU Exception Handlers for IntelŪ Architecture Processors, IntelŪ Document #243291. This application note provides information to help software engineers write the most robust Floating-Point Unit (FPU) exception handlers possible. Also see the IntelŪ PentiumŪ Processor Family Developer's Manual, Volume 3, IntelŪ Document #241430, contains three chapters about programming the floating point unit, including one chapter dedicated to programming examples. Also see the IntelŪ Architecture Software Developer's Manual, Volume 1: Basic Architecture, IntelŪ Document #243190, Chapter 7 and Appendix C. What mode of addressing do the IntelŪ Processors use? IntelŪ processors since the Intel386 processor can run one of three modes. They are the Real mode, Protected mode and SMM mode. You can also add a fourth mode called Virtual 8088 mode, which is considered a pseudo mode of the protected mode. When the processor starts booting the computer, the processor starts in real mode where it operates like a 8086 processor that can see up to 1 MB of RAM. The native mode for the processor is the Protected mode which it will switch into while it loads Windows* or some other advanced operating system. While in protected mode, the processor uses segmented (non-linear) addressing, as opposed to linear addressing. Segmented addressing means that memory (physical memory and virtual memory) is divided into 64K blocks. This is the maximum value for the Instruction Pointer (IP) register. The IP register works with the Code Segment (CS) register to point to the memory location from where the microprocessor should fetch its next instruction. The IP uses 4 bytes for memory addressing, therefore making 0FFFFH the maximum memory location (0FFFFH = 64K). How to find detailed technical specifications for your processor The links in the table take you to the IntelŪ Processor family. Here you can see processor specifications and do comparisons to other IntelŪ Processors. If you click on a processor family and do not see your processor, try using the search box in the upper right corner of the screen. Click inside the search box for a list of search options.
    Desktop processors | Mobile processors
    4th Generation IntelŪ Core i7-5xxx Desktop Processors (LGA2011-v3 socket) | N/A
    3rd Generation IntelŪ Core i7-4xxx Desktop Processors (LGA2011 socket) | 4th Generation IntelŪ Core i7 Mobile Processor Extreme Edition
    2nd Generation IntelŪ Core i7-3xxx Desktop Processors (LGA2011 socket) | 3rd Generation IntelŪ Core i7 Mobile Processor Extreme Edition
    Previous Generation IntelŪ Core i7 Desktop Processor Extreme Edition | 2nd Generation IntelŪ Core i7 Mobile Processor Extreme Edition
    4th Generation IntelŪ Core i7 Desktop Processor | Previous Generation IntelŪ Core i7 Mobile Processor Extreme Edition
    3rd Generation IntelŪ Core i7 Desktop Processor | 4th Generation IntelŪ Core i7 Mobile Processor
    2nd Generation IntelŪ Core i7 Desktop Processor | 3rd Generation IntelŪ Core i7 Mobile Processor
    Previous Generation IntelŪ Core i7 Processor | 2nd Generation IntelŪ Core i7 Mobile Processor
    4th Generation IntelŪ Core i5 Desktop Processor | Previous Generation IntelŪ Core i7 Processor
    3rd Generation IntelŪ Core i5 Desktop Processor | 4th Generation IntelŪ Core i5 Mobile Processor
    2nd Generation IntelŪ Core i5 Desktop Processor | 3rd Generation IntelŪ Core i5 Mobile Processor
    Previous Generation IntelŪ Core i5 Processor | 2nd Generation IntelŪ Core i5 Mobile Processor
    4th Generation IntelŪ Core i3 Desktop Processor | Previous Generation IntelŪ Core i5 Processor
    3rd Generation IntelŪ Core i3 Desktop Processor | 4th Generation IntelŪ Core i3 Mobile Processor
    2nd Generation IntelŪ Core i3 Desktop Processor | 3rd Generation IntelŪ Core i3 Mobile Processor
    Previous Generation IntelŪ Core i3 Processor | 2nd Generation IntelŪ Core i3 Mobile Processor
    IntelŪ Core2 Extreme Desktop Processor | Previous Generation IntelŪ Core i3 Processor
    IntelŪ Core2 Quad Desktop Processor | IntelŪ Core2 Extreme Mobile Processor
    IntelŪ Core2 Duo Desktop Processor | IntelŪ Core2 Quad Mobile Processor
    IntelŪ PentiumŪ Desktop Processor | IntelŪ Core2 Duo Mobile Processor
    IntelŪ CeleronŪ Desktop Processor | IntelŪ PentiumŪ Mobile Processor
    IntelŪ CeleronŪ D Processor | IntelŪ CeleronŪ Mobile Processor
    IntelŪ Atom Processor | IntelŪ Atom Processor
    IntelŪ PentiumŪ Processor Extreme Edition | IntelŪ CeleronŪ M Processor
    IntelŪ PentiumŪ D Processor | IntelŪ Core Duo Processor
    IntelŪ PentiumŪ 4 Extreme Edition | IntelŪ Core2 Solo Processor
    IntelŪ PentiumŪ 4 Processor | IntelŪ Core Solo Processor
    IntelŪ PentiumŪ III Processor | IntelŪ PentiumŪ III Processor
    IntelŪ PentiumŪ II Processor | Mobile IntelŪ PentiumŪ II Processor
    IntelŪ PentiumŪ Pro Processor | IntelŪ Atom Processor
    IntelŪ PentiumŪ Processors with MMX Technology | N/A
To find information on all Intel products such ARK | Your source for information on Intel products. IntelŪ PentiumŪ III Processors